Wafer Inspection

Advanced defect detection for post-fab process management. For both standard and flip chip wafers up to 200mm in diameter, the WS-2800 Wafer Inspection System provides superior yield management for defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing and final manufacturing can negativel ...more

Post-probe wafer inspection with die binning capability.  ...more

ADE's AWIS Systems are fully automatic scanning asurface inspection tools that identify and classify particle and cystalline defects on silicon and epi wafers. Modular transports allow full factory automation (FA) and flexible sorting configurations. ...more

The IMS-LM series linear stages are designed for self-supporting applications with travel ranges from 300 mm to 600 mm. The stages feature a robust design with high performance but with low cost, making them cost-effective solutions for precision industrial applications such as semiconductor wafer inspection, microelectronics test and assembly, ...more

For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need nondestructive inspection for surface purity and evenness. Checking for defects beneath the surface is also especially important, as is measurement of features such as die bonds, ...more

Inspect the kerfs of post-saw wafers for chipping and cracking caused by the dicing process and store die bin data without die inking.   ...more

The fastest and most comprehensive 300mm wafer inspection system in the business. Advanced defect detection. Plus the flexibility to handle 3D metrology with the highest accuracy. No wonder the WS-3800 is the industry choice for any application.  ...more

Inspect wafers according to predetermined routines, and log and classify defects.  ...more

For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need nondestructive inspection for surface purity and evenness. Checking for defects beneath the surface is also especially important, as is measurement of features such as die bonds, ...more

The FEINFOCUS FOX Series is the one of the most versatile high resolution X-Ray inspection system families on the market today. Designed as a modular system concept, the FOX is available in several different configurations based on your particular application. Whether your requirement is for ultra high magnification, high resolution analysis o ...more

At the IBM Microelectronics Test Solutions Center, you will find wafer probe capability for 4" to 12" . Hot and cold chuck testing from -50°C to 150°C is also available. We use a wide variety of probing techniques from cantilever through Cobra (vertical array) Probing Technology and our capabilities include pre/post test inspection. ...more

The Prior Scientific motorized Shuttle Stage is designed to be used with the Nikon and Olympus wafer loader systems for 3, 4, 6, and 8 inch wafers. The system greatly reduces operator fatigue while increasing inspection accuracy and repeatability.  ...more

The MHF-D100LR-IR light source is based on our standard 100W Halogen light source. This light source is effective not only for Si, but also for compound semiconductors. It can be used for many applications such as wafer on wafer alignment, MEMs inspection, and void inspection. LM-100-IR 100W spare lamps for the MHF-D100LR-IR are also available. ...more

The solar wafer "WISC" system combines automated wafer cassetting with integrated laser measurement and high speed digital imagining technology to provide 100%, in process, wafer inspection. Solar wafer stacks are singulated and the individual wafers are cassetted at a process rate of 800-1000 wafers per hour ...more

UV Imaging with Intevac's Exclusive Back-illuminated CMOS Sensors. MicroVista-UV is the world's first back-illuninated CMOS camera optimized for ultra-violet response. Applications: Semiconductor wafer inspection and mask alignment. Electronics: solder inspection, PCB inspection, photoresist exposure control. ...more

Dark field wafer inspection system for 45 nm generation Effective for yield enhancement by the high sensitivity / high speed inspection capabilities. Superior cost effective inspection tool. DFC (Dark field real time classification) Recipe set up in minutes. Precise coordinate system for SEM review. ...more

DUV light source. Capable of various process applications. High sensitivity for<= 90nm node technologies. Inspection Method: Cell-to-cell mode, Die-to-die mode, Hybrid mode. ...more

ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an image-processing unit. This combination allows 100% inspection of ball or bump placement on a wide variety of substrates and ...more

Aerotech's AVS100/AVSI100 series stages offer the ideal solution for applications that require very small incremental movements in elevation above a horizontal plane. Their small profiles and precise motion capability make these stages ideal for use in semiconductor wafer inspection and testing, fiber optics assembly and inspection, automated t ...more

LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles. ...more

Aerotech?s Wafermax T rotary stage is an excellent choice for applications that require high performance in a low-height package. Originally designed for the demands of precision wafer inspection, the Wafermax T stack-up benefits have been applied to a multitude of applications. A standard 25 mm aperture allows for easy pass-through of vacuum l ...more

Wafer Inspection and Metrology equipment available to purchase. ...more

High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm). High positioning accuracy (+/-30µm). Wafer Size 300mm / 200mm. ...more

The demand for a high accuracy, robust, open-frame stage is met with the ATS3600. This dual-axis, large aperture, open-frame stage addresses the unique needs of scanning microscopy, wafer and printed circuit board inspection, and automated assembly. ...more

High speed and high sensitivity EB wafer inspection system for 45 nm and beyond. New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast). Real-time Automatic Defect Classification function is also available. ...more