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Showing results: 331 - 345 of 438 items found.

  • Low-leakage Switch Matrix Family

    Keysight Technologies

    Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test.  Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution.  Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested.  This reduces both test time and cost.  Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.

  • Defect Inspection System

    NovusEdge - Onto Innovation

    The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.

  • Multi-Wafer Test & Burn-in System

    FOX-XP - Aehr Test Systems

    The key features of the new FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 "Universal Channels" per wafer, which allows the system to test all the devices on the wafer in parallel. The new "Universal Channel" architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing.

  • Photonics Test Solutions

    Chroma ATE Inc.

    Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often intefrated into production solutions for wafer probe test, burn-in and device or module characterization with inspection, metrology, robotics, Industry 4.0 and more.

  • CMP Tester

    CP-6 - Rtec Instruments

    The state of the art Rtec CMP tester CP-6 allows to study and characterize CMP process like never before. In addition to polishing wafers & substrates the tester comes with inline surface profilometer. This combinations sheds information on why and how the surface, friction, wear etc. changed. Tester also measures several inline parameters such as friction, surface roughness, wear volume etc. to understand the process in detail.

  • microLED Testing System

    OmniPix-ML1000 - InZiv

    The OmniPix-ML1000 is the first all-encompassing microLED testing system, offering both full wafer and localized individual pixel inspection. Measure localized and total EQE. Use automated PL and EL to test and characterize your microLEDs. Analyze defective pixels with nano-PL and nano-EL.

  • Probe Card

    T90™ Series - Celadon

    The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.

  • Probe Only Manipulator

    LSP - inTEST Corporation

    The LSP mounts to standard prober hinge mounts with easy access to service and engineering locations. This reduces the floor space per test cell, saving you significant capital expenses. And you’ll be able to quickly and easily set up your ATE to wafer probe.

  • Benchtop Metrology Solution

    FilmTek 2000 PAR-SE - Scientific Computing International

    Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.

  • Process & Material Characterization System

    TriboLab CMP - Bruker Nano Surfaces

    Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.

  • Analog & Digital Mixed Signal IC test System

    QT-8000 Series - PowerTECH Co,Ltd.

    Tester is applicable to regularDC/AC parameter testing and IC device performance testing. Main application: Power Management; Digital Consumer Products; Communication& Interface; Automotive; Energy Conservation electronics; Standard Linear Circuit; Memory; CPU Chips; Special Customized IC and Wafer Test.

  • Hand Held Probe Type Eddy Current Sheet Resistance/resistivity Measurement Instrument

    EC-80P (Portable) - NAPSON Corp.

    *Auto-measurement start by probe head contacting to sample*3 measurement modes for wafer resistivity, bulk resistivity and sheet resistance*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range*Resistivity probe can be changed by sample’s resistivity range

  • Test Socket Based Elastomeric Matrix Connectors

    Z-Axis Europe

    Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.

  • Hydrofluoric Acid Monitor

    CM-200A/210A - HORIBA, Ltd.

    The CM-200A/210A hydrofluoric acid monitors have been developed specifically to meet the stringent demands of semiconductor manufacturing. The CM-200A/210A provides a real time read-out of hydrofluoric acid concentration by measuring the electric conductivity of the sample solution. These superior units offer high repeatability even at low concentrations. The CM-200A/210A can be used for a variety of purposes ranging from monitoring etched wafer cleaning processes to any other industrial application of hydrofluoric acid.

  • Reflection/Transmission Spectrophotometry

    FilmTek 3000 PAR-SE - Scientific Computing International

    Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.

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