Showing results: 226 - 240 of 435 items found.
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LIGHTiX -
Unity Semiconductor SAS
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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Brooks Automation, Inc.
The Brooks field-proven wafer transport robots and modules deliver high performance and low total cost of ownership to create manufacturing efficiency, accelerate innovation, and drive profits for today’s manufacturers.
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Electrogrip Company
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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PN-50α -
NAPSON Corp.
*Principle: Photovoltaic effect by light pulse irradiation*No damage and no stain by Non-contact method*Possible to check even oxidized film on wafer surface*Instantly discrimination by optical pulse illuminate
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Tokyo Seimitsu Co., Ltd.
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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MX 152 -
E+H Metrology GmbH
To allow three thickness scans during belt transport at different wafer sizes, two measuring bars, one from top and one from bottom, hold 3 sensors each.
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Ismeca NY32W -
LTX-Credence
32-position turret platform for semiconductors on film-frame wafer media, providing highest inspection yield. Integrating innovative hardware and software technologies such as intelligent features that enables extended autonomous operation and productivity.
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EC-80 -
NAPSON Corp.
*Easy operation and compact design*Auto-measurement start by inserting a wafer under the probe*Easy set up to measurement condition by JOG dial*5 types of model for each measuring range
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VLSI Standards, Inc.
The Absolute Contamination Standard (ACS) is used to calibrate instruments which size and detect particles on the surface of bare silicon wafers. Use ACS to characterize particles, before particles characterize products.
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PVE300 -
Industrial Vision Technology Pte Ltd.
Solar Cell Multi-function SR/QE Testing System is specially designed for Photovoltaic Industry to characterize the Optical Performance of Raw material, process wafer, finished solar cell, as well as small Module.
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SPS 2600, SPS 2800, and SPS 12000 Series -
MicroXact, Inc.
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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VLSI Standards, Inc.
Resistivity Standards are bare silicon wafers available in 3 in, 8 in and 12 in sizes. The silicon is p-type (Boron) doped to nominal resistivity values, from 0.002 ohm.cm to 75 ohm.cm as available on the 3" model.
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CFM25S120-T -
ELMA Electronic, Inc.
AC/DC power supply with 25 W from Cincon | input ranges 90 - 264 VAC | output 12 V | operates in temperature from -30 to +70 °C | class II | wafer version
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CFM25S360-T -
ELMA Electronic, Inc.
AC/DC power supply with 25 W from Cincon | input ranges 90 - 264 VAC | output 36 V | operates in temperature from -30 to +70 °C | class II | wafer version