Showing results: 166 - 180 of 435 items found.
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MXI Quadra 7 -
Nordson Corporation
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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SemiProbe
Built using our PS4L patented technology, SemiProbe manufactures a family of Vacuum Probing Systems, which test wafers or substrates in a vacuum environment. Additionally, individual die and broken/partial wafers can be tested with the Vacuum Probing System. All key modules are interchangeable and upgradeable.
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Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
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WCT-120TS -
Sinton Instruments
Wafer lifetime measurement instrument Offering calibrated analysis of temperature-dependent carrier-recombination lifetime.
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Alacron
Alacron, Inc. is capable of processing sensor wafers on a contract basis to produce backside illuminated wafers sensitive in the UV and soft X-Ray region with an array of anti-reflective coatings based on licensed patented, (US 8,395,243 and US 8,680,637), technology from Jet Propulsion Laboratory (JPL).
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WDF 12DP+ -
Tokyo Electron Ltd.
The WDF 12DP is a prober/handler capable of transporting and testing standard 300-mm wafers and dicing frames without need of a changeover kit. To support multiple tests after dicing, it has a special positioning function that differs from former types, as well as image-processing functions such as wafer level packaging.
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Evans Analytical Group®
A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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FOX-15 -
Aehr Test Systems
Up to 15 wafers at a time Known Good Die solution Lowers production cost
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JRT Photovoltaics GmbH & Co. KG
The highly sophisticated machine platform HJT TRAY AUTOMATION ensures the fully automated loading and unloading of trays for inline-coating processes. Outstanding innovation is the particularly surface-friendly, yet high-performance handling of wafers in inline flat-carrier transport. This involves high-precision, row-by-row positioning of the wafers which are individually measured.
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Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Creative Design Engineering, Inc.
*Type: EFEM*Wafer load: FOUP*Wafer size: 300mm*Mini Environment: yes*Probe Change: 1, 2 or 4 probes*Aligner: yes*Size: depends on configuration*Range: 1mΩ/☐ to 10MΩ/☐*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Spartan™ -
Brooks Automation, Inc.
The unified wafer management system gives the Spartan™ Sorter the minimum scale and complexity required to accomplish its core job – to move wafers as cleanly and as quickly as possible. The Spartan Sorter offers improved reliability and maximized efficiency, while delivering industry-leading cleanliness with the lowest particle levels.
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KerrMapper S300 and V300 -
MicroSense, LLC
The KerrMapper family of tools utilizes the longitudinal Magneto-Optical Kerr Effect (MOKE) to characterize the magnetic properties of magnetic multi-layer wafers for data storage, MRAM, and other magnetic sensors. Utilizing a non-contact full-wafer measurement technique, the KerrMapper S300 and V300 systems create a map of the magnetic properties of entire wafers.
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MFM310 -
Rigaku Corp.
Thickness, density, roughness & composition of films on blanket and patterned wafers. The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
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Recif Technologies Inc.
RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum handling Systems.Based on this historical technical mastery, Recif Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.