NF0.5 - DC-40GHz High frequency test socket( Compliant pin applicable for LGA and other array type packages. Suitable for high frequency measurement;

LEAD SERIES SOCKET - Test Socket ?PACKAGE SIZE : QFP 4x4 ~ QFP 28x28 mm ?SOCKET BASE : Body floating alignment ?Contact type :

NF0.5BL-L, NF0.8L, NF1.3L, NF2.5L) - Test socket Pin life is improved by using Ni material to make contact with the hard pad material. It delivers increased pin life and improved yield while keeping high frequency characteristics.

MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.

5 RFFT - TEST SOCKET RF Filter Power amplifier RF filter transceiver

F Type - test socket For For Small size(<10mmx10mm) BGA, QFN, LGA ?Hinged clip-on lid with spring-controlled device contactor

A Type - Test Socket ?For BGA, QFN, LGA ?Hinged clamshell lid with rotation knob (180° turn for full contact, adjustable)

QFN Test Sockets Leading the Movement Toward Miniaturization Because we lead the miniaturization movement, we offer the widest line of pitches available. As these pitches continue to shrink, the mechanical challenges become extreme.

D Type - Test Socket ?For QFN, LGA ?Double-latched clip-on lid with spring-controlled lead-press / device contactor

1017BGA - TEST SOCKET 35x35 Test Device : 1017BGA, 35x35, 1.0pitch Socket Size : 70x70x7.62t SLT TEST

145BGA - TEST SOCKET 6x6 Test Device : 145BGA, 6x6, 0.4pitch Socket Size : 24x24x5t

LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated

QFN Test Sockets Because we lead the miniaturization movement, we offer the widest line of pitches available. As these pitches continue to shrink, the mechanical challenges become extreme

Series 6556 - Universal Test Socket Receptacle Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.

Leaded ROL™400 - Test Socket The Leaded ROL™400 Series has incorporated Johnstech's patented ROL™ technology to provide excellent electrical performance and proven mechanical reliability for leaded devices. The ROL™ technology is ideally suited for high volume production testing and it is also offered in two Contact configurations developed specifically for the unique challenges and different device platings used in Lead-Free Testing.

Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm

160QFP - TEST SOCKET Test Device : 160QFP, 28x28, 0.65pitch Socket Size : 56x56x8.8t

Water Cooling - test socket For High Power Device ?Hinged clamshell lid with rotation knob and heat-sink & Wafer cooling

GDDR3 - GRAPHIC CARD TEST SOCKET SOCKET SIZE : 116.4 X 118.8 X 36 t (mm) SOCKET MATERIAL : TORLON4203 & A6061

ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test

Series 547 - Universal SOIC ZIF (Zero-Insertion-Force) Test Socket Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].

Test Socket Lids For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors

52LAN - TEST SOCKET Wireless LAN MODULE