Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
WinWay well-designed Probe Head provides superior electrical performance and durability with capability of single die test. It is easy to install and maintain, significantly reducing the downtime. In all domains, we develop to be you best IC test partner.
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
DI high performance CSP, BGA and LGA test sockets offer high bandwidths, consistently low resistance and low inductance for your high performance testing requirements. We employ spring contact probes and other alternate contact technologies in a fixed or floating nest socket design depending on which approach best meets the critical requirements of your test application.
WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specif...
This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets.
POP is a new packaging technology intended to vertically combine discrete logic and memory BGA packages, where two packages lay on top of one another, and a standard interface routes the signals between them. WinWay pop socket is capable to accurately and simultaneously test both packages with contact elements (0.40mm pitch) to match with different electrical requirements.
Combining innovation with best known methods for test socket design and manufacturing, Modus Test provides a full range of high performance test sockets and contactors for applications from characterization and lab analysis to high volume manufacturing.
WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
Newly developed "Spring probe" realized advancement of contact stability with Multi-point-contact plungers. The unique structure allows for significant improvement of yield rate in production line by longer pin life and less cleaning frequency.