Test Sockets

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  • BGA Test Sockets BGA devices rule this market. There are plenty of challenges associated with high pin count BGA devices, but your test socket should not be one of them. In order to make sure it is not, we utilize a variety of materials and design methodologies.
    Synergetix
  • ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test
    Johnstech International
  • CBT-QFN-7033 - Test Sockets The CBT-QFN-7033 stamped spring pin socket is designed for testing DFN6 (six-contact dual-flat no-leads) electronic filters. The contactor used in CBT-QFN-7033 socket has 34-gram actuation force per ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.9 nH, insertion loss is <1 dB at 9.1 GHz, and capacitance is 0.03 pF. The current capacity of each contactor is 2.2 A. Socket temperature range is -55°C to +155°C. The socket also features a clamshell lid, and it accommodates two DFN devices. $543 in unit quantities.
    Evaluation Engineering
  • Image Sensor Test Socket (dead-bug fully-grid) Image Sensor Test Socket (dead-bug fully-grid)
    Unitechno
  • Ardent LGA / BGA Test Sockets High node-count area array RF sockets are a featured Ardent Product Suite. We build sockets with more than 2000 nodes and the shortest electrical path available in a discrete node contactor. Ardent Concepts has developed a BGA/LGA family of sockets which within a 2.5X2.5 footprint, are able to accommodate up to 50mm X 50mm device. 
    Ardent Concepts
  • Leaded ROL™400 - Test Socket The Leaded ROL™400 Series has incorporated Johnstech's patented ROL™ technology to provide excellent electrical performance and proven mechanical reliability for leaded devices. The ROL™ technology is ideally suited for high volume production testing and it is also offered in two Contact configurations developed specifically for the unique challenges and different device platings used in Lead-Free Testing.
    Johnstech International
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Quality Test Socket & Contactor We can offer you a wide range of High Quality ~ and High Performance Contactor Solutions for all nearly all applications in the Semiconductor and Electronics Industry. We are focused on precision machined test sockets, contactor and test fixture solutions We take care for excellent performance, high reliability and long life in your development of volume environment. We can engineer our sockets best fitting to your existing hardware setup, replace existing competitor sockets or design customized sockets based on your personal socket features. We provide one solution for engineering and volume production
    Aps Solutions GmbH
  • LED test sockets for standard and high-brightness LEDs All test sockets are suitable for LED adapters with 25 mm diameter and include power supply cables with banana plugs for connection to a current source. The list of available LED test sockets is already quite extensive and is continually updated to accommodate new packaging types on the market.
    Instrument Systems
  • Test Socket Lids For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
    UWE Electronics
  • Series X55X - Universal ZIF (Zero-Insertion-Force) DIP Test Socket Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
    ARIES Electronics
  • Flip-Top™ BGA Test Sockets Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
    Advanced Interconnections
  • POP - High Performance Test Socket POP is a new packaging technology intended to vertically combine discrete logic and memory BGA packages, where two packages lay on top of one another, and a standard interface routes the signals between them. WinWay pop socket is capable to accurately and simultaneously test both packages with contact elements (0.40mm pitch) to match with different electrical requirements.
    WINWAY Technology
  • Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
    UWE Electronics
  • Series 537 - Universal PLCC ZIF (Zero-Insertion-Force) Test Socket Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries  insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
    ARIES Electronics
  • Series 6556 - Universal Test Socket Receptacle Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
    ARIES Electronics
  • QFN / QFP / SOP - High Performance Test Socket WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
    WINWAY Technology
  • CMOS Test Socket WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.
    WINWAY Technology
  • Kelvin - test socket Suitable for accurate Kelvin measurements. Up to 5A(Continuous current) can be measured. Same performance as other J-contacts, self cleaning structure increases pin life.
    Micronics JAPAN Co.ltd
  • WLCSP Probe Head - High Performance Test Socket WinWay well-designed Probe Head provides superior electrical performance and durability with capability of single die test. It is easy to install and maintain, significantly reducing the downtime. In all domains, we develop to be you best IC test partner.
    WINWAY Technology
  • BGA/CSP/Strip - Test socket Newly developed "Spring probe" realized advancement of contact stability with Multi-point-contact plungers. The unique structure allows for significant improvement of yield rate in production line by longer pin life and less cleaning frequency.
    Micronics JAPAN Co.ltd
  • NF0.5 - DC-40GHz High frequency test socket( Compliant pin applicable for LGA and other array type packages. Suitable for high frequency measurement;
    Micronics JAPAN Co.ltd
  • QFP Test sockets Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets.
    UWE Electronics
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.