POP is a new packaging technology intended to vertically combine discrete logic and memory BGA packages, where two packages lay on top of one another, and a standard interface routes the signals between them. WinWay pop socket is capable to accurately and simultaneously test both packages with contact elements (0.40mm pitch) to match with different electrical requirements.
WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
WinWay well-designed Probe Head provides superior electrical performance and durability with capability of single die test. It is easy to install and maintain, significantly reducing the downtime. In all domains, we develop to be you best IC test partner.
DI high performance CSP, BGA and LGA test sockets offer high bandwidths, consistently low resistance and low inductance for your high performance testing requirements. We employ spring contact probes and other alternate contact technologies in a fixed or floating nest socket design depending on which approach best meets the critical requirements of your test application.
Combining innovation with best known methods for test socket design and manufacturing, Modus Test provides a full range of high performance test sockets and contactors for applications from characterization and lab analysis to high volume manufacturing.
WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
All test sockets are suitable for LED adapters with 25 mm diameter and include power supply cables with banana plugs for connection to a current source. The list of available LED test sockets is already quite extensive and is continually updated to accommodate new packaging types on the market.
Cascade Microtech provides a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices. Custom configurations are available upon request.
Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.