Test Sockets

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  • CMOS Test Socket WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.
    WINWAY Technology
  • BGA Test Sockets BGA devices rule this market. There are plenty of challenges associated with high pin count BGA devices, but your test socket should not be one of them. In order to make sure it is not, we utilize a variety of materials and design methodologies.
    Synergetix
  • Test Sockets Combining innovation with best known methods for test socket design and manufacturing, Modus Test provides a full range of high performance test sockets and contactors for applications from characterization and lab analysis to high volume manufacturing.
    Modus Test
  • Image Sensor Test Socket (dead-bug fully-grid) Image Sensor Test Socket (dead-bug fully-grid)
    Unitechno
  • QFN / QFP / SOP - High Performance Test Socket WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
    WINWAY Technology
  • LGA52 - Test Socket Sireda Technology provide high performance LGA52 Test Socket, High quality and efficiency.Long life span,Probe Replaceable,Frame guide is changeable,easy maintenance and low cost.Pressure adjustable, make sure pressure could be applied evenly on IC.
    Sireda Technology
  • Flip-Top™ BGA Test Sockets Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
    Advanced Interconnections
  • Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
    UWE Electronics
  • BGA / LGA / CSP - High Performance Test Socket WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
    WINWAY Technology
  • NF0.5BL-S, NF0.8S, NF1.3S, NF2.5S) - Test socket Effect of uniquely designed self cleaning structure;Contamination adhered to pin tip are removed during insertion. Loadboard is protected from contamination by silicone elastomer.
    Micronics JAPAN Co.ltd
  • QFN/QFP/MLF - High Performance ATE Test Sockets for Chipscale Packages Ardent's patented Scrub-R contact technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

    All-metal technology allows Ardent RC Scrub-R™ products to offer unparalleled performance, speed, and consistency.
    Ardent Concepts
  • QFN - Test Socket Sireda Technology provide the QFN test socket, QFN socket.
    Sireda Technology
  • Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm
    Yamaichi Electronics
  • Series 547 - Universal SOIC ZIF (Zero-Insertion-Force) Test Socket Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
    ARIES Electronics
  • ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test
    Johnstech International
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Test Socket/Contactor Lids Cascade Microtech provides a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices. Custom configurations are available upon request.
    Cascade Microtech
  • NF0.5BL-L, NF0.8L, NF1.3L, NF2.5L) - Test socket Pin life is improved by using Ni material to make contact with the hard pad material. It delivers increased pin life and improved yield while keeping high frequency characteristics.
    Micronics JAPAN Co.ltd
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies
  • Kelvin - test socket Suitable for accurate Kelvin measurements. Up to 5A(Continuous current) can be measured. Same performance as other J-contacts, self cleaning structure increases pin life.
    Micronics JAPAN Co.ltd
  • Dyno - Test Sockets for QFN Devices These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 ? which results in higher first past yields and a lower cost of test.
    Synergetix
  • CBT-QFN-7033 - Test Sockets The CBT-QFN-7033 stamped spring pin socket is designed for testing DFN6 (six-contact dual-flat no-leads) electronic filters. The contactor used in CBT-QFN-7033 socket has 34-gram actuation force per ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.9 nH, insertion loss is <1 dB at 9.1 GHz, and capacitance is 0.03 pF. The current capacity of each contactor is 2.2 A. Socket temperature range is -55°C to +155°C. The socket also features a clamshell lid, and it accommodates two DFN devices. $543 in unit quantities.
    Evaluation Engineering
  • LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated
    Instrument Systems
  • QFN Test Sockets Leading the Movement Toward Miniaturization Because we lead the miniaturization movement, we offer the widest line of pitches available. As these pitches continue to shrink, the mechanical challenges become extreme.
    UWE Electronics

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.