Test Sockets

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  • Quality Test Socket & Contactor We can offer you a wide range of High Quality ~ and High Performance Contactor Solutions for all nearly all applications in the Semiconductor and Electronics Industry. We are focused on precision machined test sockets, contactor and test fixture solutions We take care for excellent performance, high reliability and long life in your development of volume environment. We can engineer our sockets best fitting to your existing hardware setup, replace existing competitor sockets or design customized sockets based on your personal socket features. We provide one solution for engineering and volume production
    Aps Solutions GmbH
  • Image Sensor Test Socket (dead-bug fully-grid) Image Sensor Test Socket (dead-bug fully-grid)
    Unitechno
  • Series 547 - Universal SOIC ZIF (Zero-Insertion-Force) Test Socket Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
    ARIES Electronics
  • CBT-QFN-7033 - Test Sockets The CBT-QFN-7033 stamped spring pin socket is designed for testing DFN6 (six-contact dual-flat no-leads) electronic filters. The contactor used in CBT-QFN-7033 socket has 34-gram actuation force per ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.9 nH, insertion loss is <1 dB at 9.1 GHz, and capacitance is 0.03 pF. The current capacity of each contactor is 2.2 A. Socket temperature range is -55°C to +155°C. The socket also features a clamshell lid, and it accommodates two DFN devices. $543 in unit quantities.
    Evaluation Engineering
  • Test Sockets Combining innovation with best known methods for test socket design and manufacturing, Modus Test provides a full range of high performance test sockets and contactors for applications from characterization and lab analysis to high volume manufacturing.
    Modus Test
  • CMOS Test Socket WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.
    WINWAY Technology
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies
  • BGA/CSP/Strip - Test socket Newly developed "Spring probe" realized advancement of contact stability with Multi-point-contact plungers. The unique structure allows for significant improvement of yield rate in production line by longer pin life and less cleaning frequency.
    Micronics JAPAN Co.ltd
  • Series X55X - Universal ZIF (Zero-Insertion-Force) DIP Test Socket Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
    ARIES Electronics
  • Ardent LGA / BGA Test Sockets High node-count area array RF sockets are a featured Ardent Product Suite. We build sockets with more than 2000 nodes and the shortest electrical path available in a discrete node contactor. Ardent Concepts has developed a BGA/LGA family of sockets which within a 2.5X2.5 footprint, are able to accommodate up to 50mm X 50mm device. 
    Ardent Concepts
  • Kelvin - test socket Suitable for accurate Kelvin measurements. Up to 5A(Continuous current) can be measured. Same performance as other J-contacts, self cleaning structure increases pin life.
    Micronics JAPAN Co.ltd
  • BGA / LGA / CSP - High Performance Test Socket WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
    WINWAY Technology
  • LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated
    Instrument Systems
  • Series 537 - Universal PLCC ZIF (Zero-Insertion-Force) Test Socket Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries  insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
    ARIES Electronics
  • Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm
    Yamaichi Electronics
  • QFP Test sockets Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets.
    UWE Electronics
  • POP - High Performance Test Socket POP is a new packaging technology intended to vertically combine discrete logic and memory BGA packages, where two packages lay on top of one another, and a standard interface routes the signals between them. WinWay pop socket is capable to accurately and simultaneously test both packages with contact elements (0.40mm pitch) to match with different electrical requirements.
    WINWAY Technology
  • NF0.5BL-L, NF0.8L, NF1.3L, NF2.5L) - Test socket Pin life is improved by using Ni material to make contact with the hard pad material. It delivers increased pin life and improved yield while keeping high frequency characteristics.
    Micronics JAPAN Co.ltd
  • Dyno - Test Sockets for QFN Devices These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 ? which results in higher first past yields and a lower cost of test.
    Synergetix
  • NF0.5BL-S, NF0.8S, NF1.3S, NF2.5S) - Test socket Effect of uniquely designed self cleaning structure;Contamination adhered to pin tip are removed during insertion. Loadboard is protected from contamination by silicone elastomer.
    Micronics JAPAN Co.ltd
  • Burn-In Test Sockets The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
    Reltech Limited
  • ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test
    Johnstech International
  • Series 6556 - Universal Test Socket Receptacle Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
    ARIES Electronics
  • Test Socket Lids For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
    UWE Electronics

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.


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