Test Sockets

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  • Series 6556 - Universal Test Socket Receptacle Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
    ARIES Electronics
  • QFP Test sockets Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets.
    UWE Electronics
  • Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
    UWE Electronics
  • BGA / LGA / CSP - High Performance Test Socket WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
    WINWAY Technology
  • Burn-In Test Sockets The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
    Reltech Limited
  • Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm
    Yamaichi Electronics
  • Leaded ROL™400 - Test Socket The Leaded ROL™400 Series has incorporated Johnstech's patented ROL™ technology to provide excellent electrical performance and proven mechanical reliability for leaded devices. The ROL™ technology is ideally suited for high volume production testing and it is also offered in two Contact configurations developed specifically for the unique challenges and different device platings used in Lead-Free Testing.
    Johnstech International
  • LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated
    Instrument Systems
  • Test Socket/Contactor Lids Cascade Microtech provides a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices. Custom configurations are available upon request.
    Cascade Microtech
  • Dyno - Test Sockets for QFN Devices These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 ? which results in higher first past yields and a lower cost of test.
    Synergetix
  • Ardent LGA / BGA Test Sockets High node-count area array RF sockets are a featured Ardent Product Suite. We build sockets with more than 2000 nodes and the shortest electrical path available in a discrete node contactor. Ardent Concepts has developed a BGA/LGA family of sockets which within a 2.5X2.5 footprint, are able to accommodate up to 50mm X 50mm device. 
    Ardent Concepts
  • Image Sensor Test Socket (dead-bug fully-grid) Image Sensor Test Socket (dead-bug fully-grid)
    Unitechno
  • Series 547 - Universal SOIC ZIF (Zero-Insertion-Force) Test Socket Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
    ARIES Electronics
  • QFN / QFP / SOP - High Performance Test Socket WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
    WINWAY Technology
  • Series 537 - Universal PLCC ZIF (Zero-Insertion-Force) Test Socket Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries  insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
    ARIES Electronics
  • CBT-QFN-7033 - Test Sockets The CBT-QFN-7033 stamped spring pin socket is designed for testing DFN6 (six-contact dual-flat no-leads) electronic filters. The contactor used in CBT-QFN-7033 socket has 34-gram actuation force per ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.9 nH, insertion loss is <1 dB at 9.1 GHz, and capacitance is 0.03 pF. The current capacity of each contactor is 2.2 A. Socket temperature range is -55°C to +155°C. The socket also features a clamshell lid, and it accommodates two DFN devices. $543 in unit quantities.
    Evaluation Engineering
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Test Socket Lids For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
    UWE Electronics
  • QFN/QFP/MLF - High Performance ATE Test Sockets for Chipscale Packages Ardent's patented Scrub-R contact technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

    All-metal technology allows Ardent RC Scrub-R™ products to offer unparalleled performance, speed, and consistency.
    Ardent Concepts
  • NF0.5 - DC-40GHz High frequency test socket( Compliant pin applicable for LGA and other array type packages. Suitable for high frequency measurement;
    Micronics JAPAN Co.ltd
  • CMOS Test Socket WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.
    WINWAY Technology
  • ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test
    Johnstech International
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies
  • Flip-Top™ BGA Test Sockets Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
    Advanced Interconnections

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.