Test Sockets

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  • Kelvin - test socket Suitable for accurate Kelvin measurements. Up to 5A(Continuous current) can be measured. Same performance as other J-contacts, self cleaning structure increases pin life.
    Micronics JAPAN Co.ltd
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies
  • CBT-QFN-7033 - Test Sockets The CBT-QFN-7033 stamped spring pin socket is designed for testing DFN6 (six-contact dual-flat no-leads) electronic filters. The contactor used in CBT-QFN-7033 socket has 34-gram actuation force per ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.9 nH, insertion loss is <1 dB at 9.1 GHz, and capacitance is 0.03 pF. The current capacity of each contactor is 2.2 A. Socket temperature range is -55°C to +155°C. The socket also features a clamshell lid, and it accommodates two DFN devices. $543 in unit quantities.
    Evaluation Engineering
  • Series 6556 - Universal Test Socket Receptacle Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
    ARIES Electronics
  • QFP Test sockets Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Because of these challenges, a common thought in the industry is that one could not use spring probe technology in leaded device test sockets.
    UWE Electronics
  • Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm
    Yamaichi Electronics
  • Leaded ROL™400 - Test Socket The Leaded ROL™400 Series has incorporated Johnstech's patented ROL™ technology to provide excellent electrical performance and proven mechanical reliability for leaded devices. The ROL™ technology is ideally suited for high volume production testing and it is also offered in two Contact configurations developed specifically for the unique challenges and different device platings used in Lead-Free Testing.
    Johnstech International
  • Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
    UWE Electronics
  • QFN Test Sockets Leading the Movement Toward Miniaturization Because we lead the miniaturization movement, we offer the widest line of pitches available. As these pitches continue to shrink, the mechanical challenges become extreme.
    UWE Electronics
  • Ardent LGA / BGA Test Sockets High node-count area array RF sockets are a featured Ardent Product Suite. We build sockets with more than 2000 nodes and the shortest electrical path available in a discrete node contactor. Ardent Concepts has developed a BGA/LGA family of sockets which within a 2.5X2.5 footprint, are able to accommodate up to 50mm X 50mm device. 
    Ardent Concepts
  • LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated
    Instrument Systems
  • QFN / QFP / SOP - High Performance Test Socket WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
    WINWAY Technology
  • WLCSP Probe Head - High Performance Test Socket WinWay well-designed Probe Head provides superior electrical performance and durability with capability of single die test. It is easy to install and maintain, significantly reducing the downtime. In all domains, we develop to be you best IC test partner.
    WINWAY Technology
  • NF0.5BL-S, NF0.8S, NF1.3S, NF2.5S) - Test socket Effect of uniquely designed self cleaning structure;Contamination adhered to pin tip are removed during insertion. Loadboard is protected from contamination by silicone elastomer.
    Micronics JAPAN Co.ltd
  • Test Sockets Combining innovation with best known methods for test socket design and manufacturing, Modus Test provides a full range of high performance test sockets and contactors for applications from characterization and lab analysis to high volume manufacturing.
    Modus Test
  • LED test sockets for standard and high-brightness LEDs All test sockets are suitable for LED adapters with 25 mm diameter and include power supply cables with banana plugs for connection to a current source. The list of available LED test sockets is already quite extensive and is continually updated to accommodate new packaging types on the market.
    Instrument Systems
  • BGA/CSP/Strip - Test socket Newly developed "Spring probe" realized advancement of contact stability with Multi-point-contact plungers. The unique structure allows for significant improvement of yield rate in production line by longer pin life and less cleaning frequency.
    Micronics JAPAN Co.ltd
  • Test Socket/Contactor Lids Cascade Microtech provides a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices. Custom configurations are available upon request.
    Cascade Microtech
  • Dyno - Test Sockets for QFN Devices These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 ? which results in higher first past yields and a lower cost of test.
    Synergetix
  • CMOS Test Socket WinWay Tech. provide a complete CMOS test socket solution, both for manual and handler automatic test. Our professional experience for ours customers Satisfaction and complete solution, we have most Sophisticated machining technology and Socket design experience, customized design, fast and Complete service is your best partner.
    WINWAY Technology
  • NF0.5 - DC-40GHz High frequency test socket( Compliant pin applicable for LGA and other array type packages. Suitable for high frequency measurement;
    Micronics JAPAN Co.ltd
  • Quality Test Socket & Contactor We can offer you a wide range of High Quality ~ and High Performance Contactor Solutions for all nearly all applications in the Semiconductor and Electronics Industry. We are focused on precision machined test sockets, contactor and test fixture solutions We take care for excellent performance, high reliability and long life in your development of volume environment. We can engineer our sockets best fitting to your existing hardware setup, replace existing competitor sockets or design customized sockets based on your personal socket features. We provide one solution for engineering and volume production
    Aps Solutions GmbH
  • Flip-Top™ BGA Test Sockets Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
    Advanced Interconnections

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.