Test Sockets

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  • LED-81x/-850 - test sockets for high power LEDs With electrical power up to several watts, high-power LEDs do not only generate high light output. The associated thermal dissipation leads to considerable warming of the LED chip and packaging, so this energy has to be properly dissipated in order to guarantee the specified LED lifetime and to avoid failure. The chip temperature also significantly affects the emitted optical power and so too the emission spectrum (color). Higher temperatures result in a reduction in the amount of light generated
    Instrument Systems
  • Test Socket (High-Frequency Type) High frequency test socket supporting SOP, SSOP, TSOP, QFP, QFN and SON packages. Supports pitches of 0.4-1.27mm
    Yamaichi Electronics
  • BGA/CSP/Strip - Test socket Newly developed "Spring probe" realized advancement of contact stability with Multi-point-contact plungers. The unique structure allows for significant improvement of yield rate in production line by longer pin life and less cleaning frequency.
    Micronics JAPAN Co.ltd
  • NF0.5BL-L, NF0.8L, NF1.3L, NF2.5L) - Test socket Pin life is improved by using Ni material to make contact with the hard pad material. It delivers increased pin life and improved yield while keeping high frequency characteristics.
    Micronics JAPAN Co.ltd
  • QFN Test Sockets Leading the Movement Toward Miniaturization Because we lead the miniaturization movement, we offer the widest line of pitches available. As these pitches continue to shrink, the mechanical challenges become extreme.
    UWE Electronics
  • QFN/QFP/MLF - High Performance ATE Test Sockets for Chipscale Packages Ardent's patented Scrub-R contact technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.

    All-metal technology allows Ardent RC Scrub-R™ products to offer unparalleled performance, speed, and consistency.
    Ardent Concepts
  • LED test sockets for standard and high-brightness LEDs All test sockets are suitable for LED adapters with 25 mm diameter and include power supply cables with banana plugs for connection to a current source. The list of available LED test sockets is already quite extensive and is continually updated to accommodate new packaging types on the market.
    Instrument Systems
  • Burn-in Test Sockets We offer semiconductor Interconnect burn-in sockets in the latest package technologies, including: • BGA and CSP • Pb and Pb–free solder • POP • SIP • Stacked die • Stacked packages.
    Sensata Technologies
  • WLCSP Probe Head - High Performance Test Socket WinWay well-designed Probe Head provides superior electrical performance and durability with capability of single die test. It is easy to install and maintain, significantly reducing the downtime. In all domains, we develop to be you best IC test partner.
    WINWAY Technology
  • NF0.5 - DC-40GHz High frequency test socket( Compliant pin applicable for LGA and other array type packages. Suitable for high frequency measurement;
    Micronics JAPAN Co.ltd
  • MultiSite Test sockets and Wafer Level multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
    UWE Electronics
  • Leaded ROL™400 - Test Socket The Leaded ROL™400 Series has incorporated Johnstech's patented ROL™ technology to provide excellent electrical performance and proven mechanical reliability for leaded devices. The ROL™ technology is ideally suited for high volume production testing and it is also offered in two Contact configurations developed specifically for the unique challenges and different device platings used in Lead-Free Testing.
    Johnstech International
  • Off-Set Kelvin Test Sockets This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
    UWE Electronics
  • QFN / QFP / SOP - High Performance Test Socket WinWay your develop design companion in socket solution for pad/leaded series. Customized design in all sorts of outlines with low inductance. Easy operate for package loading and unloading in different application. Various contact elements to match with different electrical requirements. Long durability with the intimate service makes us your best companion in socket solution.
    WINWAY Technology
  • Dyno - Test Sockets for QFN Devices These test sockets provide consistent low and stable resistance with minimal cleaning and a mechanical cycle life of greater than 500,000 ? which results in higher first past yields and a lower cost of test.
    Synergetix
  • Burn-In Test Sockets The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
    Reltech Limited
  • BGA / LGA / CSP - High Performance Test Socket WinWay high performance BGA ,LGA and CSP test sockets provide extension bandwidth, Impedance control and minimize the electrical noise and is committed to in various aspects fulfill your testing requirements. To satisfy high frequency testing demand by general pogo pin solution, we had developed metal housing shielding to reduce the crosstalk between the pogo pins. And explore all avenues to become your test application indispensable partner.
    WINWAY Technology
  • Flip-Top™ BGA Test Sockets Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch.
    Advanced Interconnections
  • Series X55X - Universal ZIF (Zero-Insertion-Force) DIP Test Socket Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
    ARIES Electronics
  • Test Socket/Contactor Lids Cascade Microtech provides a wide variety of lids featuring outstanding mechanical stability for superior electrical connections. Easy-to-use and very cost effective, these socket lids have been designed to help you quickly and effortlessly test a broad range of devices. Custom configurations are available upon request.
    Cascade Microtech
  • ROL™200 Series - Leaded Test Socket The self-cleaning wipe action of the "rolling contact" design provides many benefits for Production Test
    Johnstech International
  • BGA Test Sockets BGA devices rule this market. There are plenty of challenges associated with high pin count BGA devices, but your test socket should not be one of them. In order to make sure it is not, we utilize a variety of materials and design methodologies.
    Synergetix
  • Test Socket for FFC/FPC cables PCB_Flex Cable connector - ZIF Test Socket
    E-tec Interconnect
  • Image Sensor Test Socket (dead-bug fully-grid) Image Sensor Test Socket (dead-bug fully-grid)
    Unitechno

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Test Sockets - Provide electro mechano connection between DUT and ATE in hand testing applications.


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