-
Product
Test Workflow Standard
-
Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
-
Product
EFT Module for Teststand
-
The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
-
Product
Interactive Benchtop Test
-
Strict time-to-market deadlines make it vital to efficiently debug and validate product designs. Virtual instrumentation provides a unified interface that gives engineers an advantage over traditional box instruments.
-
Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
-
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
-
Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3100 with Intel MXM GPU
-
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
-
Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
-
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
-
Product
Cable Free ATE
CABLEFREEATE
-
Digalog Systems customizes resources to provide requirements or more cost-effective requirements that are not currently on the market.The CableFreeATE™ technology also affords lower cost and easier integration of some common offerings:- VPC 64 SPST Reed Relay- 0.1" Discrete Header 64 SPST Reed Relay- DL1-156R 72 SPST Reed Relay
-
Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
-
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
-
Product
Design for Testability (DFT Test)
-
Corelis can provide you with design consultation and an analysis of your design for boundary-scan testability. We will review your design and make specific recommendations that if implemented will improve the testability. We can also suggest improvements that will increase test coverage and allow boundary-scan to be implemented in a more cost-effective manner.This service also includes a DFT test coverage analysis that we recommend to do after schematic capture and before PCB layout. At this stage of product development, Corelis provides you with a comprehensive test coverage reports that identifies all of the boundary-scan nets and pins and classifies them as completely tested, partially tested, or not tested. The report also recommends where to add test points (pads) for physical “nails” access if additional test coverage is required.
-
Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
-
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
-
Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
-
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
-
Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
-
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
-
Product
High-Performance 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXC-6400 Series
-
The Matrix MXC-6400 series is a line of high-performance fanless embedded computers, integrating 6th generation Intel® Core™ i7/i5/i3 processors and the QM170 chipset for more powerful computing and graphics performance with minimal power consumption.
-
Product
Computer On Modules
COM Express Basic
-
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
-
Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
-
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
-
Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
-
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
-
Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
-
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
-
Product
Open Test Platform for High Performance Automotive Applications
TSVP
-
The R&S®TSVP family of products is an open test platform from Rohde & Schwarz ideal for high performance automated test equipment (ATE) applications. The chassis contains a mechanical frame, digital backplane, analog backplane, mains switching and filtering, power supply and diagnostic extensions. A highlight is the analog bus for routing measurement signals between different slots without additional external wiring.
-
Product
Universal OTP Functional Test System for the Production of Level and Fluid Sensors
-
Multifunctional function tester with parallel test function based on the LXinstruments OTP2 system platform. The system is used for assembly, final test and calibration of liquid and level sensors for commercial vehicles, construction machinery and shipbuilding in a high mix / medium volume environment.
-
Product
Wireless Device Test
-
New wireless standards, in addition to rising wireless usage, are increasing wireless device complexity while lowering price expectations. To counter rising costs, manufacturers require test systems optimized for efficiency.
-
Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
-
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
-
Product
Semiconductor Test System
TS-960e
-
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
-
Product
Functional Test Fixtures
-
Forwessun’s Functional Test Fixtures are tailored to validate the performance of your electronic assemblies, ensuring each product meets critical quality and functional standards. With customisable designs and precision engineering, these fixtures support a range of testing needs—from checking connectivity and function to confirming performance under real-world conditions. Built to handle rigorous demands, Forwessun's solutions are ideal for industries requiring reliable and repeatable results. Whether for high-volume production or specialised testing, our fixtures provide robust, adaptable support to maintain efficiency and accuracy throughout the testing process. We also create, and work with Ingun to create fixtures using the Ingun kit.
-
Product
Active Alignment Assembly & Test Platform
-
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
-
Product
Intel® Celeron J1900 & Atom™ E3825/ E3845, 3.5" SBC
MIO-5850
-
Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1333MHz 2/4GB on boardDirectX11, OpenGL3.2, OpenCL1.2, Dual display: HDMI, VGA, LVDSCPU bottom up design for system integration and rugged design for variable automation factory environments3 Intel i210 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, 16 bit GPIO, full-size Mini PCIe/M.2 E Key, half size mSATA, 12-24V Power input, SIM Card holder, CANBUS with IsolationSupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
-
Product
NI HIL and Real-Time Test Software Suite
-
Suites combine LabVIEW Professional Development System with NI's most popular application softwareIncludes LabVIEW Professional, VeriStand, and the LabVIEW Real-Time and LabVIEW FPGA modulesEach new suite includes a one-year NI Training and Certification membershipSoftware is shipped on USB 3.0 media with NI device drivers included to speed up your installationConfigure real-time test applications quickly and easily; add custom functionality
-
Product
Scienlab Battery Test System — Cell Level
SL1002A
-
Test System with up to 36 Channels.The Keysight SL1002A provides sink and source with 0 to 6 V, 100 to 600 A, 0.6 to 3.6 kW and 36 channels for battery cells.
-
Product
Non-Signaling RF Test Platform for Validation & Production
Universal Wireless Tester
-
Wireless communication standards are increasingly integrated into vehicles as well as smart home and Internet-of-Things applications. They form the basis for connected services, advanced HMIs, and autonomous driving. The combination of constantly evolving standards and the integration of multiple wireless technologies with many RF channels into new product designs means that measurement speed and quality are becoming a priority.
-
Product
PXI Integration Platform
ATS-3100
-
The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
-
Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
-
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
