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Orion Delta Design Contact Info Send To Colleague The Orion can handle CSP, BGA, QFN, and other devices on laminated/molded panels or strips, as well as devices in lead frames, including TSOP, TSSOP, SOIC, MSOP, and SOT. The Orion functions as a standalone system or can be linked for in-line integration with other back-end processes. ...more -
Model 55V6 IC Test Handler Aetrium Incorporated Contact Info Send To Colleague Aetrium?s Model 55V6 IC Test Handlers are ideally suited for high volume production handling of small devices using tube input and tube output media. The small footprint handler is capable of handling a wide variety of packages including SOIC, SSOP, TSOP, TSSOP, MSOP, QSOP, Chip Scale and many other new leadless QFN packages. ...more -
AS212-93 Skyworks Solutions, Inc. Contact Info Send To Colleague The AS212-93 is an IC FET 4 x 2 matrix switch in a low cost TSSOP-16 exposed paddle plastic package. The exposed paddle should be grounded. The AS212-93 enables 16 states directing any of the four inputs to any of the two outputs. DC block capacitors are required at each RF port. States are selected by 4 positive controls. All ports are absorp ...more -
Model V8 IC Test Handlers Aetrium Incorporated Contact Info Send To Colleague Aetrium?s Model V8 IC Test Handlers are ideally suited for quad- or dual-site high-volume production handling of small devices using tube or magazine input and output media. The small footprint handler is capable of handling a wide variety of packages including SOIC, SSOP, TSOP, TSSOP, MSOP, QSOP and many other new leadless QFN packages. ...more -
Model QT - IC Test Handlers Aetrium Incorporated Contact Info Send To Colleague Aetrium QT Test Handler is a bench-top sized machine designed to accomplish small lot production runs, engineering characterization and other QC/QA applications. Device kits are available for SOT23, SOT223, SC59, SOIC, MSOP, TSSOP, TO-220, TO-252, TO-90, Chip Scale Packages and other leadless packages. ...more -
AA264-87 Skyworks Solutions, Inc. Contact Info Send To Colleague The AA264-87 is a 4 bit, single positive control GaAs IC FET digital attenuator in a low cost TSSOP-16 package. The attenuator requires external DC blocking capacitors, positive supply voltage (VS) and four individual positive control voltages (V1V4). The AA264-87 is particularly suited where high attenuation accuracy, low insertion loss ...more -
HelixFS-TR BPM Microsystems Contact Info Send To Colleague As a desktop automated system, the Helix comes standard with two precision-designed tray input and output handling system. Integrated in the handler are two BPM Micro Flashstream programming sites with providing the fastest programming times for Flash memories. The Helix system is designed to handle a wide range of packages including but not l ...more -
Thin Shrink Small Outline Package (TSSOP) STATS ChipPAC Ltd. Contact Info Send To Colleague STATS'' Thin Shrink Small Outline Package (TSSOP) is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides. The ultra thin TSSOP is made possible by optimal wire looping control during the wire bonding process as well as optimal package warpage control during the molding process. The TSSOP is designed to fill the ...more -
WEDGE CLIP - 0.50MM & 0.65MM SSOP, TSOP, TSSOP, TQFP Emulation Technology, Inc. Contact Info Send To Colleague Wedge Clip technology ensures reliable probing of 3, 8 or 16 signals on 0.5mm or 0.65mm pitch signals. The clip alleviates the frustration of accidentally shorting IC pins together; the electrical or mechanical problems associated with soldering, and/or holding multiple probes while using your scope. The clip is excellent for those times when a ...more -
Tapestry SC MCT, Inc. Contact Info Send To Colleague The MCT Tapestry SC is a second-generation strip test handler that provides increased performance and greater flexibility at lower cost. ...more -
Final Test Capability KYEC Contact Info Send To Colleague At KYEC's Final Test we perform 100% electrical testing as per customers parameters / test program with dedicated changeover kits for a wide range of IC packages. Capability at Final Test includes small packages to high pin count and covers the following form factors: PDIP, PLCC, full SOIC range ? SOP, TSOP, TSSOP, MSOP, QFP, LQFP, TQFP, QFN , ...more
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Definition: Thin Shrink Small Outline Package |
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