SPICE

The SMV1405SMV1419 series of silicon abrupt junction varactor diodes are designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies beyond 2.5 GHz. The devices are characterized for capacitance over temperature. ...more

Micro-Cap 9 is an integrated schematic editor and mixed analog/digital simulator that provides an interactive sketch and simulate environment for electronics engineers. ...more

This series of 8, 20 and 70 V rated low cost plastic packaged Schottky diodes are designed for general purpose use in RF applications as detectors, mixers and switches and in digital pulse forming applications. All diodes are fully characterized including SPICE model parameters and deliver tight parameter distribution, minimizing performance v ...more

The SMV1231SMV1237 series of silicon hyperabrupt junction varactor diodes are designed for use in VCOs with low tuning voltage operation. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies beyond 2.5 GHz. The SMV1231SMV1237 series is fully characterized for capaci ...more

The SMV1405SMV1419 series of silicon abrupt junction varactor diodes are designed for use in VCOs requiring tight capacitance tolerances. The low resistance of these varactors makes them appropriate for high Q resonators in wireless system VCOs to frequencies beyond 2.5 GHz. The devices are characterized for capacitance over temperature. ...more

ESP-CV verifies that two different design representations are functionally equivalent. These designs may be described as Verilog behavioral models, RTL, UDP’s, gates, transistors, or SPICE netlist views. ...more

Q3D Extractor is 3D/2D quasi-static electromagnetic-field simulation for parasitic extraction of electronic components. Q3D Extractor utilizes the Method of Moments (MOM) and the Finite Element Method (FEM) to compute 3D RLC/2D RLCG parameters of a structure and automatically generates an equivalent SPICE sub-circuit. ...more

Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today's complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an ...more

SGvision™ PRO is a new tool to analyze mixed level descriptions, both top level structures described in Verilog and lower level structures described via SPICE, can be debugged in a single integrated environment. ...more

SpiceVision PRO takes the complex SPICE descriptions produced by many EDA tools and generates clean, easy-to-read transistorlevel schematics and circuit fragments, and design documentation to speed up debugging and project development. ...more

FineSim Pro defines a new paradigm in full-chip circuit-level simulation, enabling the simulation of the most challenging analog/mixed-signal SoCs with SPICE accuracy and unprecedented performance. ...more

FineSim SPICE defines a new paradigm in circuit simulation, enabling the simulation of the most challenging analog/mixed-signal designs with SPICE accuracy and unprecedented performance. ...more

K466 is a simulator application of SCAT (Switching Converter Analysis Tool) software for switching power converters. SCAT employs definitely original algorithms developed in EEL (Energy Electronics Laboratory) , SOJO University, Japan. SCAT is newly developed and does not at all depend on any other existing software such as SPICE. ...more