Showing results: 1 - 15 of 93 items found.
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Hamamatsu Photonics K.K.
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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PlasmaSTAR -
Axic Inc.
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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Axic Inc.
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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AX2600 And AX2700 -
MKS Instruments
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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RU-1000 -
HORIBA, Ltd.
The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Advanced Energy
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements. From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
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UVS300|UVS 10/35 -
HORIBA, Ltd.
The UVS300 and UVS 10/35 are UV Plasma sources with high intensity, working with different gases.
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MKS Instruments
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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PA-3000-A ETCHER -
TEK-VAC INDUSTRIES Inc.
Process chamber with plasma view window and full access hinged door. RF hot process shelves with opposing ground electrodes. Throttle valve. Capacitance manometer. Internal pumping system with option for Fomblin filled chemical series mechanical pump. Flow control electronics and cabinet. Up to four mass flow control assemblies can be incorporated into our system. RF matching network and 600 watt maximum power supply. Fully enclosed cabinet. Custom internal fixturing to accommodate specific substrate shapes and sizes. Plasma gas selection for optimal performance.
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MAXstream -
Advanced Energy
Advanced Energy’s MAXstreamTM line is the next generation of remote plasma sources for chamber cleaning. The MAXstream is available in 3, 6, 8, 10, and 12 SLPM NF3 flow rates to optimize price and performance.
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Advanced Energy
Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Advanced Energy
Equip your manufacturing and abatement processes with high functionality and exceptional reliability. Customize your chemistry. Expand your operating range. Deliver higher process rates. Advanced Energy’s remote plasma sources offer sophisticated options in streamlined designs.
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Elemental Analysis, Inc.
Inductively Coupled Plasma Techniques can be very powerful tools for detecting and analyzing trace and ultra-trace elements. Over the past years, ICP-MS has become the technique of choice in many analytical laboratories for providing the accurate and precise measurements needed for today’s demanding applications and for providing required lower limits of detection.
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Xstream -
Advanced Energy
The highly efficient Xstream® RPS dissociates large volumes of NF3 and quickly cleans chambers, improving your overall tool performance. Its plasma chamber showcases high-purity aluminum alloy and patented cooling capabilities. Built to last for years without repair or expensive chamber coatings, the Xstream RPS is the smart choice for dependability and efficient performance.
