PBGA

Orbotech's Ultra Discovery Series brings exceptional inspection performance for FC-BGA and advanced fine-line PBGA, CSP, FPC and COF production. Our field-proven SIP-powered systems come equipped with super-fast optical heads, specially designed for inspection of the finest lines down to 10µm. When combined with dedicated IC substrate panel underst ...more

is the highest quality bench top 3 dimensional BGA inspection system available today. Featuring an advanced 3-Chip CCD Camera! Constructed with ESD safe components, it enables the operator to inspect BGA, PBGA, CBGA and MICRO-BGA for micro-cracking, surface structure, excess flux residue and much more. ...more

SBP (Solder Ball Placement) is equipped with the flexibility to attach solder balls on PBGA, singulated BGA and array BGA packages. Capable of handling solder ball size of 0.2mm at 0.4m pitch. Substrate vision alignment system. Proprietary positive ball handling mechanism. Vision inspection to check for missing/ double/ offset/. oversize/ unde ...more

STATS' Plastic Ball Grid Arrays (PBGA) meet current established industry standards and offer thermal solutions from 0-4 watts using 2-layer and 4-layer substrates. STATS' PBGA is a laminate substrate based package with plastic overmolded encapsulation and an array of solder ball terminals. The PBGA package provides a low cost, advanced technology p ...more