Showing results: 1 - 15 of 77 items found.
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T5833/T5833ES -
Advantest Corp.
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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T5230 -
Advantest Corp.
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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T5511 -
Advantest Corp.
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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T5831/T5831ES -
Advantest Corp.
High-productivity tester achieves low cost-of-test by performing massive parallel testing of NAND Flash and MCPs for SSDs and mobile applications
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T5851/T5851ES -
Advantest Corp.
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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T5830/T5830ES -
Advantest Corp.
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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T5835 -
Advantest Corp.
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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T5503HS2 -
Advantest Corp.
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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T5830 -
Advantest Corp.
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Teledyne LeCroy
Teledyne LeCroy’s PCI Express 5.0 Test Platform is part of a suite of tools that facilitates complete protocol testing of PCI Express devices up to and including version 5.0. The latest feature of the Teledyne LeCroy Test Platform is the addition of an integrated interposer, which eliminates the need for an external interposer. This innovation simplifies setup with fewer connection points and outboard devices, making analysis easier and more reliable than ever. In addition to using the Test Platform with the Exerciser, the user can connect two of their own devices and use the Test Platform as a PCIe 5.0 backplane and as an interposer to capture protocol traffic between the systems.
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PXP-500A -
Teledyne LeCroy
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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GT9000 -
Guide Technology, Inc.
GT9000 is a scalable 2 to 10 channelsBench-Top CTIA and/or TIC Test Platformwith 10” touch-screen-display (iPhone quality), integrated GUI with Touch, Ethernet, WiFi and/or wireless keyboard & mouse.
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GT9000P-USB3 -
Guide Technology, Inc.
A 2 channel Portable “CTIA” and/or “TIC” Test Platform controlled by USB3
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GT9000R -
Guide Technology, Inc.
GT9000R is a scalable 2 to 24 channels 19”Rack-Mount CTIA and/or TIC Test Platformwith integrated GUI, Ethernet, Wi-Fi and/orwireless keyboard & mouse.
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iWave Systems Technologies
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
