Showing results: 1 - 15 of 44 items found.
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Nexus Technology, Inc.
Memory interposers for logic analyzers and oscilloscopes are ordered by memory type. Please select the memory type/technology of interest.
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Teledyne LeCroy
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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XMC850 -
Silicon Control Inc.
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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VPX850 -
Silicon Control Inc.
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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SerialTek
SerialTek’s PCIe Gen3 Slot (AIC) Interposers with SI-Fi technology are specially designed test adapters that are physically placed in between the PCIe slot and a PCIe endpoint to intercept and relay a copy of the high-speed signaling and discrete data lines to the PCIe Analysis system in real-time.
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LGA -
Ardent Concepts, Inc.
Molded 1mm Pitch BGA Sockets using Connect-R™ technology are available off the shelf to meet your immediate needs. These durable multi-GHz BGA socket solutions offer low loss compression mount connection for processors, FPGAs, ASIC, MMICS and other high performance devices. Ardent BGA Sockets can be modified for any package size up to 50mm x 50mm with short lead times. RC Connect-R BGA Sockets & LGA Interposers are perfect for RF applications with temperature excursions and can stand up to the most demanding environmental factors. Hardware options are available for a variety of temperature control and mounting configurations.
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FS2660A -
FuturePlus Systems
The FS2660A is our newest and fastest logic analyzer probe used to test DDR5 RDIMM or LRDIMM memory. It is designed to work exclusively with 2 Keysight U4164A logic analysis modules operating with CHA + CHB independent busses. This gives the user an extremely effective tool for debugging, testing and verifying DDR5 RDIMM/LRDIMMs and DDR5 Memory Channels.
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Silmat -
Phoenix Test Arrays llc
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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FS2361 -
FuturePlus Systems
The FS2361 is a logic analyzer probe used to test DDR3 DIMM memory. When used with the triggering and analysis capabilities of Keysight’s U4154/64 Logic Analyzer modules, it gives the user an extremely effective tool for debugging, testing and verifying DDR3 DIMMs.
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OCP NIC 3.0 -
Teledyne LeCroy
The Summit product family includes a wide variety of Interposer systems, designed to reliably capture serial data traffic while minimizing perturbations in the serial data stream. Probes include interposers, which are designed to capture data traffic crossing the PCI Express card connector interface, and MidBus probes, which are designed to capture traffic flowing within a PCB.
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PCIE850 -
Silicon Control Inc.
The PCIE850 provides a complete test and debug solution for PCI Express Bus. Interposers and probes connect to the PCIE850 providing access to PCI Card, AMX, XMC and VPX systems.
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W3301A -
Keysight Technologies
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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N2114A -
Keysight Technologies
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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N2115A -
Keysight Technologies
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
