Taurus - Inspection System Our inspection system TAURUS is used for detection of cracks and inclusions in complete wafer stacks. The lateral direction of view (parallel to wafer surface) has the advantage that this concept is not disturbed by the natural structure of grain boundaries. With the help of the exact determination of the positions of defect wafers in a stack they can be separated afterwards easily.

Candela CS20 - High Brightness LED Automated Wafer Inspection System The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.

X8011 - In-line-Capable X-ray Inspection System Newer and multi-layered technologies require inspection solutions suitable for making concealed and ever-smaller structures visible. Typical application areas for the X8011 include inspection of populated PCBs, electronic components, and also the challenges of non-destructive testing (NDT) and general quality assurance.

NEO-690Z / NEO-890Z - X-ray Inspection System Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.

TeraScanHR - Reticle Inspection System The TeraScanHR Reticle Defect Inspection System provides powerful technology and productivity features that enable the production of defect free reticles for 45nm. The new defect inspection system includes higher resolution optical imaging for a smaller pixel size, new capabilities for inspecting aggressive Optical Proximity Correction (OPC), and higher speed image processing to improve productivity

603d - Backplane Profiling & Inspection System A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.

Vi-4x03FX - B&W Chip Defect Inspection System (High-Speed Model) Vi-4x03FX is a flag ship machine which make high-speed human level inspection possible. Vi-4x03FX corresponds to power device, CIS and the other devices using Topcon technohouse’ Know-how.

26700-102-00 - Micro Zoom Video Inspection System w Standard Stand Micro Lens Zoom Lens with Fine Focus 0.7x to 4.5x with 1x coupler and a 0.5x objective lens Focus Mount with Coarse and Fine Focus Standard Stand with 10 threaded holes. Allows you to fixture your part if necessary. Size of base 279 x 330 mm (11"x 13") with Stainless Steel post 406.5mm (16") tall VGA 1.3M HD color camera with built in SD Card. Camera. For more information on the camera, Click Here Fiber Optic Illuminator 150 Watt with Ring Light This modular system can be upgraded to meet your magnification or high accuracy measurement requirements. Call us at 734-973-0099 for customization.

03-0001-09-00 - Cell front side inspection system EL- inspection technology The ATM EL inspection system is a fast, EL contact technology and very small and easy to use system to detect defects in cells for solar production application.

aspire2 - 3D Solder Paste Inspection System aSPIre 2 is the only 3D SPI system that Provides a complete solution to the common bottlenecks that hinder conventional inspection systems. Koh Young’s innovative technology provides true, accurate 3D inspection data by solving a number of critical problems that can result in inaccurate and unreliable inspection. Koh Young’s patented 3D measurement and inspection technology in the aSPIre 2 delivers the fastest, the most reliable inspection result.

Vision Systems - Vision System and Vision Inspection Systems Innovar is an integrator and machine builder for vision system inspection systems. We have partnered with the leading technology suppliers to offer the best vision system solutions.

X2 2D X-Ray - Automated In-line X-Ray Inspection System Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

AITTFH - In-Line Pattern Wafer Defect Inspection System offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.

WAOI Master 4000 - CMOS Wafer Inspection System This system is an optical inspection system which inspects the particles on the surface of CMOS Wafer, surface scratch defect, pad marking, ink marking or dead pixel automatically.

Model 3710-HS - Solar Wafer Inspection System Integrated with 2D Geometry, Surface, Micro Crack, Saw mark inspection system and Resistively & Thickness, Lifetime tester by customer defined, Chroma 3710HS is a fully user configuration wafer sorter system with very low breakage rate and high through put.

03-0001-02-04 - Cell front side inspection system FS print and color The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.

dimensionCONTROL 8260 - Silicon Ingot Inspection System The “dimensionCONTROL 8260 for Ingot” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. Ingot lengths up to 2500 mm

Vi-4202R - B&W Chip Defect Inspection System (Standard Type) Vi-4202R is the high cost performance machine which inherited the system of Vi-4202 which is sold 200 or more sets in the world. From the conventional system, operability is improved and it has become a more user-friendly inspection machine.

Falcon 500 - Advanced optical inspection systems Camtek's Falcon 500 line of advanced optical inspection systems handles wafers before or after electrical / functional test. Designed to ensure known-good die, the Falcon 500 consistently detects visible defects that may impact die integrity or interconnect reliability.

FyrEyeP 4200 - Bottled Product Inspection Systems Inspects the packaging, containers and contents of packaged liquid products.

410 - Gross Leak Test System for single-device inspection Accurate gross leak testing in seconds. For fast, accurate gross leak testing of hermetic electronic packages. Using air pressure alone, the NorCom 410 inspects a single device for gross leaks in less than 15 seconds.

X8060 NDT - Universal 2-D/3-D X-ray Inspection System X-ray inspection delivers information about the interior of a 3-D inspection object. Even in 2-D mode, quick, highly magnified views of the third dimension are possible. But with the help of modern computer tomography, the 3-D mode allows the reconstruction of complete volumetric models, allowing non-destructive slices to be made or measurements taken in any direction.

GlassChek Plus - X-ray Inspection System, Four Beam The GlassChek Plus x-ray inspection system is most suitable for the inspection of wide neck and non-uniform glass jars. Its software plots the individual dimensions of every glass jar that passes through the x-ray beam, detecting contaminants in the product as well as possible inclusions in the glass jar itself.