Inspection Systems

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  • FyrEyeP 3400 - Assembly Inspection System Inspects part assemblies for proper and complete assembly, and use of correct components.
    FSI Technologies
  • phoenix nanome|x - Nanofocus X-ray Inspection System The phoenix nanome|x is an ultra high-resolution nanofocus X-ray inspection system designed for inspecting high-quality assemblies and interconnections in the semiconductor and SMT industries. The system offers excellent performance and versatility and can be used for 2D X-ray inspection as well as for full 3D computed tomography (nano ct).
    GE Measurement &
  • VisEdge CV300 - Wafer Edge Inspection System Representing the semiconductor industry?s first inspection solution capable of meeting the full range of wafer-edge inspection requirements in a production environment, the VisEdge CV300 system leverages KLA-Tencor?s proven Optical Surface Analyzer (OSA) technology. Many advanced IC manufacturers are facing an average of 10 to 50 percent greater yield loss at the wafer?s edge relative to their best yielding region and a comprehensive inspection strategy that includes advanced edge inspection has become critical. Built on a highly extendible platform, the tool?s combination of unique optics design and advanced defect classification capabilities allows IC manufacturers to overcome the limitations of existing edge inspection techniques and enable broader capture and better distinction of edge defectivity to increase yield.
  • LS-6700 - Bare Wafer Inspection System High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).
    High positioning accuracy (+/-30µm). Wafer Size 300mm / 200mm.
    Hitachi High-Technologies
  • Vi-4202R - B&W Chip Defect Inspection System (Standard Type) Vi-4202R is the high cost performance machine which inherited the system of Vi-4202 which is sold 200 or more sets in the world. From the conventional system, operability is improved and it has become a more user-friendly inspection machine.
    TOPCON TechnoHouse
  • AFIS - Automated Inspection System for Fiber Optic Connectors The AFIS has the ability to inspect up to 60 connectors at a time without the need for someone to visually inspect each connector.
    Nanometer Technologies
  • Z-NIR - Near Infrared Inspection System The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
    McBain Systems
  • SPI 2500 - Solder Paste Inspection System The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. To do analysis and monitoring role for solder paste printing process, the SPI 2500 embeds lots of useful tools and various measuring modes, those are auto and manual measuring modes. The machine?s scanning capability backed by precise laser sheet beam and scanning stage brings users the real 3 dimensional shape of a feature.
  • microINSPECT - Manual Inspection System The MicroINSPECT™ wafer inspection system integrates more applications with ergonomic ease of operation. A small footprint, high speed, low cost per feature and serviceability contribute to its' award winning CoO.
  • IVI 1000 - Vision Inspection System IVI is an automated, reliable and cost effective machine vision solution for Post Wire Bond Inspection and measurement. The system utilises a unique and proprietary sub-pixeling technology with localised calibration and distortion correction enabling high accuracy measurement with unsurpassed repeatability.
    In.D Solution
  • 02-0000-02-00 - Wafer optical and geometry inspection system The ATM optical and geometry inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.
    ATMvision AG
  • GlassChek Plus - X-ray Inspection System, Four Beam The GlassChek Plus x-ray inspection system is most suitable for the inspection of wide neck and non-uniform glass jars. Its software plots the individual dimensions of every glass jar that passes through the x-ray beam, detecting contaminants in the product as well as possible inclusions in the glass jar itself.
  • Platiscan VI - Visual Inspection System PlatiScan VI, has been developed to provide a very novel approach to Visual Inspection. The system was developed for the pcb assembly business but can be applied to many production industries.
    WG-Test GmbH
  • Candela CS20 - High Brightness LED Automated Wafer Inspection System The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.
  • STRATUS II - AOI (Automated Optical Inspection) systems The STRATUS II is the best system on the world market for the in-line inspection of multilayer hybrids, LTCC/HTCC and other screen or stencil printed, electroplated or sputtered structures. In-line inspection, where the wet print is inspected directly after the screen printer (and before the parts go into the drying oven), is the best way to ensure that no serial defects like a hole in the screen or screen aging, can happen.
    Stratus Vision GmbH
  • BF-TristarII - Inspection System BF-Tristar II is the automated optical inspection system which inspects both sides of double-sided PCBs at once. At the same time, this system achieves the same inspection speed with single side inspections. It is equipped with two cameras for scanning each side of a PCB and has the Saki’s unique alternate scanning system. It also has 30 mm clearance on both sides. BF-Tristar II is suitable for inspections on the final process after the component assembly. With 10 µm resolution, BF-Tristar II provides accurate and stable inspection of 01005 (0402) chips. Newly developed color capturing system takes only 8 seconds to scan M-size boards.
  • FyrEyeP 4200 - Bottled Product Inspection Systems Inspects the packaging, containers and contents of packaged liquid products.
    FSI Technologies
  • Y.COUGAR VXP - 2D & 3D Microfocus X-ray Inspection System Designed to meet a wide range of rigorous needs of the electronics, automotive, military and aerospace, telecom and medical device markets, the compact Y.Cougar microfocus platform provides the most versatile X-ray solution for 2D and 3D inspection in the market.
    YXLON International
  • 410 - Gross Leak Test System for single-device inspection Accurate gross leak testing in seconds. For fast, accurate gross leak testing of hermetic electronic packages. Using air pressure alone, the NorCom 410 inspects a single device for gross leaks in less than 15 seconds.
    NorCom Systems
  • PowerChek / PowerChek Plus Series - X-Ray Inspection System, Foreign Bodies The PowerChek and PowerChek PLUS x-ray inspection systems deliver detection and elimination of foreign bodies in bulk products regardless of its shape or location within the product. Any contaminants are quickly eliminated through a single, multi-flap or multi-airblast rejection system (maximum 64 reject channels possible), minimising waste and improving productivity.
  • Falcon 500 PD - Wafer inspection systems Post-dicing inspection offers the last opportunity to capture defects from preceding processes while the dice are still packed in wafer format. Camtek's Falcon 500PD line of automatic framed wafer inspection systems delivers superb detection of surface and probe mark defects, bump size and placement deviations, as well as dicing-related defects.
    Camtek Intelligent
  • GlassChek - X-ray Inspection System, Dual Beam The GlassChek x-ray inspection system is a dual beam x-ray system that detects foreign bodies like glass shards in glass jars and can simultaneously ensure product integrity for a wide range of glass containers. The variations in thickness and shape inherent in glass jars prove to be no problem for the GlassChek x-ray system.
  • Bandoleer - Continuous Web X-ray Inspection System he Bandoleer x-ray inspection system is suitable for the inspection of blister packs, powder and sachet bandoleers before cutting and packaging. It is the first x-ray inspection system in the world which allows simultaneous filler feedback and inspection at the filler station.
  • NIR-01 - Silicon Inspection System The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.

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