Production inspection for High-Volume Advanced Fabs to Rapidly Detect and Map Non-Visual Defect Contamination.Sub-atomic Layer Sensitivity to Wafer Surface Chemistry Variation and Contamination. Non-contact, Non-destructive Inspection. Rapid High Resolution Whole-wafer Mapping and Imaging.
The ATM FS- 3D Grid inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application. this system can be used also for double print measurement.
The Tie Bolt Inspection System US-1779 employs eddy current technology for nondestructive testing of tie bolts used in aircraft wheels. Now in use by commercial and military aircraft. The system can test the threads as well as the underside of the bolt head. The system includes the UniWest's US-454A eddy current instrument, the UniWest Tie Bolt Scanner (US-1779), and specialty probe US-1839. The specialty probe detects flaws in both steel and inconel bolts.
An inspection equipment for 4th generation glass substrate. An original detection optics achieve high sensitivities. This equipment also features accurate front and back surface separate detection, a video monitor for particle review, and a high throughput for substrate.
Suitable contamination control for 8th generation LCD process. The GI7500 is an inspection equipment for 8th generation glass substrate that uses an original detection optics for high inspection sensitivity and high reliability. It's high-speed inspecting and high-magnification particle review by TV monitor make the GI7500 ideal for inspecting the glass.
Wafer Inspection System (WIS) with new Black Label TechnologyInline Wafer Inspection System with Loader and SorterThis Wafer Inspection System (WIS) has been technically relaunchedand is based on the latest Black Label Technology made by ATMvision AG.
The “dimensionCONTROL 8260 for Ingot” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. Ingot lengths up to 2500 mm
The phoenix pcba|inspector is a high-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints (e.g. BGA, QFN, QFP, PTH, CSP, Flip Chip) in board assemblies, but also for inspection of electronic and mechanic components and more.
X-ray inspection delivers information about the interior of a 3-D inspection object. Even in 2-D mode, quick, highly magnified views of the third dimension are possible. But with the help of modern computer tomography, the 3-D mode allows the reconstruction of complete volumetric models, allowing non-destructive slices to be made or measurements taken in any direction.
High Speed AOI System. Testing of small stampings on • stamping impressions • scratches • bendings • egde damage • foreign body • completeness Optical resolution / testing accuracy • up to minimal 5 microns per pixel.
High speed and high sensitivity EB wafer inspection system for 45 nm and beyond. New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast). Real-time Automatic Defect Classification function is also available.
Performs high speed, stable inspections of roll sheet FPC work. This is a fully automatic inspection system, so the operator has nothing more to do after the initial setting. Its combined jig alignment and work alignment functions shorten initial setting time and permit high precision positioning.
The VFI-200 performs much the same tasks as the VFI-1200 BUT it is optimised for the inspection of 125 µm diameter fibers. If you only need to look at telecom type fibers this is the unit for you as it's high native resolution makes it the highest magniifcation interferometer around.
Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
The Jewel Box 70-T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system?s high-resolution MXRA® x-ray camera and 10-micron MicroTech? x-ray source provide magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
The HP2 and HP3 Series systems integrates the most essential fiber tools into a single solution that cuts test time in half and delivers a better network performance. Both systems allow technicians to work smarter and faster with a tool that promotes best practices in an efficient workflow. Doing things right the first time protects the network investment by preventing costly mistakes that could affect network performance later on. The result is a significant increase in workflow efficiency and ...