Inspection Systems

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  • 26700-102-10 - Micro Zoom Video Inspection System on Boom Stand Micro Lens Zoom Lens with Fine Focus 0.7x to 4.5x with 1x coupler and a 0.5x objective lens E-Arm with focus control Double Arm Boom Stand with a heavy duty base (285 x 260mm), 380mm vertical post and a 225mm extension post and 570mm horizontal post. Allows for smooth travel over specimen being viewed
  • IP-2200 - Inspection Pro Visual Inspection System Automatic appearance inspection systems are evolving in response to ever-evolving mounted PCBs. However, there is little major change in visual inspection process. Rather, it eseems that burden on visual inspection work is ever-increasing due to the miniaturizaiton of mounted components.
    WIT Co. Ltd
  • X-eye 5000 Series - X-ray inspection system for PCBA/SMD and Electronic Components X-eye 5000 Series provide a superior X-ray inspection solution to reduce costs and increase throughput. Equipped a micro-focus X-ray tube, X-eye 5000 series provide high-quality X-ray image with ease of use. The system comes with auto-teaching (CNC programming) along with Auto BGA Inspection module.
    SEC Co. Ltd
  • SMX-1000/1000L - Microfocus X-Ray Inspection System Compact, easy-to-operate, high-functionality X-ray inspection system. Both the SMX-1000 and SMX-1000L provide high-magnification nondestructive fluoroscopic examinations of junction conditions (disconnect, contact) of ultra-micro parts on high-density PCBs, BGAs, CSPs, or system LSIs.
  • 03-0001-02-05 - Cell front side inspection system FS print, color and SiNx coating thickness The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.
    ATMvision AG
  • InVision - Inline Orbotech's Inline Inspection Systems Automated Optical inspection is an integral part of today?s rigorous quality and process control procedures. Orbotech's InVision? series of systems provide the ultimate automated solution for high-speed FPD inspection.
    Orbotech Ltd
  • OHT-7006/7006L - Solder printing inspection machine Solder Paste Inspecion System High speed inspection by laser FLY method. Inspection time: PC motherboard (300m x 210mm), approx. 30 seconds (Inspection time will vary slightly according to inspection conditions).
  • Portable GPS Flight Inspection System The portable GPS flight inspection system (GFIS) developed by Parker Electronic Systems Division, allows any helicopter light fixed-wing aircraft to be use as a GPS Non-Precision approach flight inspection aircraft.
    NXT Flight Inspection
  • Nano 3000 - Visual Inspection System The Nano 3000 combines all the features of a high end inspection system into a compact footprint. Featuring high speed, high precison linear motors, the Nano 300 is ideal for sub micron inspection at high speed for productions or research.
    Pacific Precision
  • X-Scope 6000 - X-Ray Inspection System The Xspection 6000 is a Digital fully programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. 70° Camera Tilt for Oblique Extreme Angle 2.5 D Inspection. Incredible 1,000X System Magnification.
  • FOCIS Fiber Optic - Connector Inspection System The Noyes Family of FOCIS integrated fiber inspection solutions provide network personnel with the capability to document fiber connector cleanliness. FOCIS combines a palm-sized DFD1 Touchscreen Tablet, a DFS1 Digital FiberScope and AFL SimpleView Plus inspection software to provide the inspection and analysis power of current laptop and probe solutions and the ergonomics, ease of use, ruggedness and ownership costs of basic "live only" viewers.
    AFL Telecommunications
  • TR7600 - Automated X-Ray Inspection system The TR7600 in-line Automated X-Ray Inspection system uses X-Ray technology to penetrate PCBs and components to capture test images. It is the ideal solution for testing BGA components and areas not accessible by other test technologies.
    Test Research
  • SPI HS60 - Solder Paste Inspection System The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder material, paste shape, and warpage.
  • VT-X700 - In-line X-Ray Inspection System The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
    OMRON Automated Optical
  • WIS - Wafer Inspection System Our Wafer Inspection System – WIS - carries out a fully automated inspection of mono- and polycrystalline silicon wafers. The modular design of the system means that individual configuration with the latest inspection technologies as well as smooth integration into your product lines is possible.
    Jonas & Redmann
  • 04-9900-00-00 BL - Wafer Inspection System (WIS) Wafer Inspection System (WIS) with new Black Label Technology Inline Wafer Inspection System with Loader and Sorter This Wafer Inspection System (WIS) has been technically relaunched and is based on the latest Black Label Technology made by ATMvision AG.
    ATMvision AG
  • 2365 - High Resolution Imaging Inspection System The 2365 high-resolution imaging inspection system provides the sensitivity, flexibility, and intelligence needed to capture yield-relevant defects, while ignoring nuisance defects?all on a cost-effective platform that has been proven in production. The 2365's superior sensitivity to all defect types makes it ideal for new technologies (such as copper, low-k dielectrics, and 193-nm resists) in advanced 200-mm and 300-mm fabs, with particular effectiveness for critical etch, critical CMP, photo, and engineering analysis.
  • Z-NIR - Near Infrared Inspection System The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
    McBain Systems
  • OP-019 156 - Optilia Digital BGA Inspection System The Optilia exclusive BGA system Produces high-resolution digital pictures with excellent colour and detail definition. It creates sharp images of solder balls under BGA packages more than 25 mm into the grid and down to 50 µm component stand-off.
    Optilia Instruments
  • JewelBox 90T - X-ray Inspection System The Jewel Box 90-T delivers precision x-ray images of ultra-high resolution and grey scale accuracy without the aberrations of voltage blooming and pincushioning prevalent in other systems. Glenbrook?s patented, award-winning MXRA® x-ray camera technology.
    Glenbrook Technologies
  • 06-9900-00-00 - Layup- String Inspection System Up to 10 sec/string - mono and multi 2D, 3D, IR und Sensor Technology Including statistics, DB and communication with Ethernet Master PC Remote control Tested and calibrated
    ATMvision AG
  • phoenix pcba|inspector - 2D Microfocus X-ray Inspection System The phoenix pcba|inspector is a high-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints (e.g. BGA, QFN, QFP, PTH, CSP, Flip Chip) in board assemblies, but also for inspection of electronic and mechanic components and more.
    GE Measurement &
  • FyrEyeP 3600 - Tablet, Capsule, and Pill Inspection Systems Inspects tablets, capsules and pills. Designed for high-speed, continuous linear production process.
    FSI Technologies
  • aspire2 - 3D Solder Paste Inspection System aSPIre 2 is the only 3D SPI system that Provides a complete solution to the common bottlenecks that hinder conventional inspection systems. Koh Young’s innovative technology provides true, accurate 3D inspection data by solving a number of critical problems that can result in inaccurate and unreliable inspection. Koh Young’s patented 3D measurement and inspection technology in the aSPIre 2 delivers the fastest, the most reliable inspection result.
    Koh Young Technology

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