The “dimensionCONTROL 8260 for Ingot” measuring system inspects the surface of the bricks using several laser line scanners and in doing so measures the side lengths, phase lengths, angles, diagonal surfaces and the planarity of the side surfaces completely automatically. Ingot lengths up to 2500 mm
High speed and high sensitivity EB wafer inspection system for 45 nm and beyond. New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast). Real-time Automatic Defect Classification function is also available.
Connector inspection is simple, fast, and convenient using AFL's FOCIS Flex. With one button, FOCIS Flex auto-focuses, captures, centers and displays the end-face image. It also applies pass/fail rules and can transfer the image and results to a paired FLX380 or OFL280 FlexTester OTDR via Bluetooth.
The VFI-200 performs much the same tasks as the VFI-1200 BUT it is optimised for the inspection of 125 µm diameter fibers. If you only need to look at telecom type fibers this is the unit for you as it's high native resolution makes it the highest magniifcation interferometer around.
The GlassChek Plus x-ray inspection system is most suitable for the inspection of wide neck and non-uniform glass jars. Its software plots the individual dimensions of every glass jar that passes through the x-ray beam, detecting contaminants in the product as well as possible inclusions in the glass jar itself.
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive archit...
Pass/fail results in seconds: With the press of a single button, FOCIS Flex auto-focuses, captures and centers the end-face image, applies pass/fail rules, displays image and pass/fail results, and wirelessly transfers image and results to a paired FLX380 or OFL280 FlexTester. All in a matter of seconds!
LS6800 are capable of detecting smaller than 40 nm defects on unpatterned wafers with high sensitivity and throughput. Those tools support yield enhancement through high precision discrimination and detection of COP defects, particles, CMP scratches and particles.
Ideal for defect analysis in the surface of substrate and disks. A high-precision surface inspection system for substrate and disk featuring a sophisticated defect classification function by laser irradiation of multi dearing and newly developed incline defect method.
aSPIre 2 is the only 3D SPI systemthat Provides a complete solutionto the common bottlenecksthat hinder conventional inspection systems.Koh Young's innovative technologyprovides true, accurate 3D inspection databy solving a number of critical problemsthat can result in inaccurateand unreliable inspection.Koh Young's patented 3D measurement andinspection technology in the aSPIre 2 deliversthe fastest, the most reliable inspection result.
Integrated with 2D Geometry, Surface, Micro Crack, Saw mark inspection system and Resistively & Thickness, Lifetime tester by customer defined, Chroma 3710HS is a fully user configuration wafer sorter system with very low breakage rate and high through put. Chroma 3710HS solar wafer inspection system is ideal for PV incoming process. Plus wafer can be sorted by user defined algorithm fully automatically into coin stack or cassette. The unique auto coin stack/cassette exchange feature eliminates ...
Effective due to the FLY method. Camera motion method achieves high speed scanning. Five cameras are standard equipment. One top camera and four inclined cameras boost detection capacity ■Super high speed inspections. Using five cameras, it can scan an M-size board in about 25 seconds.
Sampling methods can allow for the inspection of as low as 2% of the parts in the lot. Unfortunately counterfeiters are smart enough to figure out how to spread parts on the tape to avoid detection.Thanks to TruView™ HAWK, your sampling days are over. A dream come true, for the first time ever, TruView™ HAWK’s breakthrough design makes 100% inspection economically possible.
The McBain ZIII Micro Inspection System is the industry standard for CD measurements and inspection, pre/post dicing inspection, pre/post probing inspection, mask inspection, image stitching and critical particle counting.
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system