Inspection Systems

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  • FyrEyeP 2700 - Wood Product Inspection Systems Instpects profiles of linear wood products, such as moldings, dimension lumber, flooring and tongue-and-groove products in low, medium and high speed linear product processes.
    FSI Technologies
  • SIGMA X - 3D Solder Inspection System World class measurement technology coupled with the industry’s fastest cycle times and exclusive process support tools maximize your return on investment and your profitability. Exclusive Dual Laser Technology eliminates shadowing. Compatible with all PCB colors, finishes and HASL. Identifies all features including via holes, edge of board and routing. Inspection speed of 100㎠/sec @ 10×10µm resolution and immediate access to results provides the highest industry throughput.
  • microINSPECT - Manual Inspection System The MicroINSPECT™ wafer inspection system integrates more applications with ergonomic ease of operation. A small footprint, high speed, low cost per feature and serviceability contribute to its' award winning CoO.
  • PW-600E - Power supply auto-inspection system PW-600E is a Universal Switching Power Supply Test System which is Cost Down and High Speed Testing type. PW-600E would provide less expensive ,fast Speed .Thanks to USB control, Much faster testing time can be provided than any other GPIB Systems. English menu is available now.
    Keisoku Giken Co
  • VT-X700 - In-line X-Ray Inspection System The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
    OMRON Automated Optical
  • ZIII - Micro Inspection System Inspection and Measuring Microscope The McBain ZIII Micro Inspection System is the industry standard for CD measurements and inspection, pre/post dicing inspection, pre/post probing inspection, mask inspection, image stitching and critical particle counting.
    McBain Systems
  • 03-0000-01-01 - Cell front side inspection system- on the fly FS- print The ATM FS- print inspection system is a fast, non-contact technology and a system very small and easy to use. It detects defects in cells for the solar production application.
    ATMvision AG
  • PowerChek / PowerChek Plus Series - X-Ray Inspection System, Foreign Bodies The PowerChek and PowerChek PLUS x-ray inspection systems deliver detection and elimination of foreign bodies in bulk products regardless of its shape or location within the product. Any contaminants are quickly eliminated through a single, multi-flap or multi-airblast rejection system (maximum 64 reject channels possible), minimising waste and improving productivity.
  • 7970 CMOS - Image Sensor Inspection System Chroma 7970 CIS Inspection System is a tray-based automatic inspection system to detect cosmetic defect on the both side of CMOS image sensor.
    Combinova Marketing
  • 03-0001-02-05 - Cell front side inspection system FS print, color and SiNx coating thickness The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.
    ATMvision AG
  • Bandoleer - Continuous Web X-ray Inspection System he Bandoleer x-ray inspection system is suitable for the inspection of blister packs, powder and sachet bandoleers before cutting and packaging. It is the first x-ray inspection system in the world which allows simultaneous filler feedback and inspection at the filler station.
  • Platiscan VI - Visual Inspection System PlatiScan VI, has been developed to provide a very novel approach to Visual Inspection. The system was developed for the pcb assembly business but can be applied to many production industries.
    WG-Test GmbH
  • InVision - Inline Orbotech's Inline Inspection Systems Automated Optical inspection is an integral part of today?s rigorous quality and process control procedures. Orbotech's InVision? series of systems provide the ultimate automated solution for high-speed FPD inspection.
    Orbotech Ltd
  • R50G - X-ray Inspection System, Foreign Bodies The R50G X-ray Inspection system is designed to detect foreign bodies and inspect fill levels of small to large diameter glass jars at high line speeds. The technology incorporates an angled x-ray beam that shoots through the base area while simultaneously inspecting the side of glass containers, providing unrivalled glass-in-glass inspection. The R50G X-ray requires no product handling, meaning no spacing between jars, maximizing throughput of up to 1,200 containers per minute.
  • BF-X2 - In-line automated X-ray inspection system Saki boosts up the inspection to another stage by this ultimate inspection system. The high-accuracy 3D image makes the detection of defects much easier. BF-X2 is our proudly offered 3D X-ray inspection system which provides a new standard of inspection system.
  • NS1500 Series - Disk Surface Inspection System Ideal for defect analysis in the surface of substrate and disks. The sophisticated classify defect can be detected by the develop and evaluation disk surface inspection system that measure at a same spindle by optical interference, laser irradiation of multi bearing and newly developed incline defect method.
    Hitachi High-Technologies
  • RTX-113 - X-ray Inspection System The RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs and Flip Chips.The system is very versatile and features Glenbrook's patented, award-winning X-ray camera technology that generates high-resolution.
    Glenbrook Technologies
  • 03-0000-03-00 - Cell back side inspection system BS print BS1, BS2 The ATM BS - print inspection system is a fast, non-contact technology. It is a system very small and easy to use. It detects defects in cells for the solar production application.
    ATMvision AG
  • X2 2D X-Ray - Automated In-line X-Ray Inspection System Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
  • I-5320 / I-6300 - Electron Beam Wafer Inspection System High speed and high sensitivity EB wafer inspection system for 45 nm and beyond. New electron optics and advanced image processing system have realized high speed and high sensitivity inspection as well as excellent measurement repeatability with enhanced VC (Voltage Contrast).
    Real-time Automatic Defect Classification function is also available.
    Hitachi High-Technologies
  • Vela Laminate - Inspection System The VELA laminate inspection system is designed as a final control of the complete laminates and is thus located after the laminator.
    Intego GmbH
  • phoenix pcba|inspector - 2D Microfocus X-ray Inspection System The phoenix pcba|inspector is a high-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints (e.g. BGA, QFN, QFP, PTH, CSP, Flip Chip) in board assemblies, but also for inspection of electronic and mechanic components and more.
    GE Measurement &
  • PipeChek / PipeChek PLUS - Single Vertical X-ray Inspection System The PipeChek x-ray inspection system is a single vertical x-ray beam system designed for inspection of pumped products, typically slurries, semi-solids and fluids before the final packaging and further value is added to the product.
  • SMX-1000/1000L - Microfocus X-Ray Inspection System Compact, easy-to-operate, high-functionality X-ray inspection system. Both the SMX-1000 and SMX-1000L provide high-magnification nondestructive fluoroscopic examinations of junction conditions (disconnect, contact) of ultra-micro parts on high-density PCBs, BGAs, CSPs, or system LSIs.

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