AWX FSI 300 - 300 mm Front Side Wafer Defect Inspection System stand alone The AWX Series automated defect inspection product series for 200 mm and 300 mm unpatterned wafers. The modular system of this compact tool consists of a 300 mm automation platform with wafer transfer and sorting capability. It can be combined with up to two modules from the NanoPhotonics MetriCube series for front side edge and back side defect inspection. This flexible system can be configured to match various applications at an optimized price performance ratio. Future metrology upgrades can easily be incorporated without changing the automation platform.

Candela CS20 - High Brightness LED Automated Wafer Inspection System The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.

DayCor® Rail - Railway UV Inspection System A professional railway UV inspection systems that incorporates the DayCor® daytime corona detection technology with shock absorbers and rugged. Designed to enable high speed automatic detection of corona and arcing, provide high resolution images and straight forward reports. Accurately pinpoints sources of corona and arcing.

03-0001-02-04 - Cell front side inspection system FS print and color The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.

03-0000-01-01 - Cell front side inspection system- on the fly FS- print The ATM FS- print inspection system is a fast, non-contact technology and a system very small and easy to use. It detects defects in cells for the solar production application.

S-786A, iScope - Microscopes and Video Inspection System Self-contained digital invention consolidates 3D microscopic viewing with image capture, on-screen keyboard, patented lighting system and network viewing capability. Plug-and-play unit avoids workbench disarray, user strains and multiple connections. Additional lenses lighting and options available.

ArtWork AOI - Automatic and Precise Film Inspection System Automatic and Precise Film Inspection System

RTX-113HV - X-ray Inspection System A high performance real-time X-ray inspection system designed for inspection of multi-layer, assembled printed circuit boards, with dense metal BGAs, and recommended for lead free inspection requirements. Our RTX-113HV system meets all your needs for inspecting BGA packages.

AIT-TFH - Micro-Defect Inspection System KLA-Tencor's AITTFH in-line pattern wafer defect inspection system offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.

26700-114, VIS-745 - Video Inspection System VIS-745 Video Inspection System consisting of MZL -745 Video Lens, 8 in LCD monitor mounted to a Focus Mount with fine focusing, VGA HD Color Camera 2M (Model 26100-252), and Stand PF with built in Flourescent Illumination

FyrEye-4000 - Family Circuit Board Inspection System Machine Vision System provides the benefits of reduced cost with 24/7 operation. Also reduces the instance of defective products slipping through human inspection.

FyrEyeP 3400 - Assembly Inspection System Inspects part assemblies for proper and complete assembly, and use of correct components.

TR7600 - Automated X-Ray Inspection system The TR7600 in-line Automated X-Ray Inspection system uses X-Ray technology to penetrate PCBs and components to capture test images. It is the ideal solution for testing BGA components and areas not accessible by other test technologies.

02-0000-02-00 - Wafer optical and geometry inspection system The ATM optical and geometry inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in wafers for solar production application.

26800B-110, VIS-750 - Microscope Based Video Inspection System SPZT-50 Stereo Zoom Microscope mounted on a Dual Arm Ball Bearing Stand with Focus Mount, 8 in LCD Monitor, Fluorescent Ring Light, CCD Adapter, and VGA Color HD Camera 2M (Model 26100-252)

Workstation OS - X-ray Inspection System The Workstation OS is a mobile fully shielded cabinet system that can be easily moved from one inspection station to another. The OS systems offer cost-effective x-ray solutions to identify defects associated with SMT processes. Applications include basic BGA inspections, multi layer board analysis and overall solder joint integrity.

VideoMic 712XA - X-Ray Inspection and Measurement System The OPTEK InnerVision is the world's first x-ray coordinate measuring machine. It measures and reports the positions of internal features such as coupon pads on inner layers of multi-layer printed circuit boards, reinforcements and fastener inserts in composite structures,and other such encapsulated or laminated features.

ISP 3000 - 3rd Optical Inspection System Fully automated leadframe handling system. Auto conversion for various leadframe sizes. Image capturing and FOV measurement capability. 2D matrix reader capability. Reject ID:- Strip map, puncher, wire breaker, bottom scribber.

ISO 9001 - Automatic Flight Inspection Systems (AFIS). ISO 9001 certified corporation specializing in the design, manufacturing, and integration of Automatic Flight Inspection Systems (AFIS).

DIS 3000 - Optical Inspection System Single wafer cassette loader or manual one piece loading for 150 and 200mm wafer rings. Optional wafer back side inspection (Brightfield only). Bar code, OCR & 2D matrix reader. Online/offline inking. Wafer mapping up/down loading & editing. Networkable with central wafer mapping system. Motorized indexing XYZ stage with recipe.

SMX-2000 - X-ray Fluoroscopic Inspection System SMX-2000 is an X-ray Fluoroscopic inspection system for observing and inspecting internal structures and mounting conditions in electronic devices.

Electric Motor Inspection Systems In addition to conventional motor tests involving test sample conveying, brake machine and torque measurement shaft, model-based testing by the Parameter-Identification (PI) method has become established in cases where motors are already installed in machinery or otherwise difficult to access. The decisive advantage of PI test stands for product control is that only easily accessible signals need be measured and mechanical coupling is unnecessary.

Ultra SPI - Solder Paste Inspection systems MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as small as 01005 and Micro-BGA. In addition MVP’s latest SPI solutions provide support for Dual Lane, Multiple Panel Inspection and microelectronics as well as full SPC reporting and data outputs.