Inspection Systems

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  • ULTRAPROBE 100 - Analog Ultrasonic Inspection System The Ultraprobe senses high frequency sounds produced by operating equipment, leaks and electrical discharges. It electronically translates these signals by heterodyning them down into the audible range so that a user can hear these sounds through a headset and see them as intensity increments on the meter. Heterodyning works the same as a radio in that it accurately transforms the sounds so that they are easily recognized and understood.
    UE Systems
  • Traqu - 3D Tomographic Inspection System Its “parallel Optical Coherence Tomography” gives the Traqu an edge in terms of measurement speed and precision on almost any surfaces. • Accuracy of a nanometer •Scan area up to 300 x 400mm.
    Essemtec AG
  • KY8030-2 - Dual Projection 3D In-Line Solder Inspection System The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Easy UI and SPC Plus are included in the system package in order to help users achieve faster & easier printer process optimization
    Koh Young Technology
  • TD-4M - Solder Paste Inspection System Inspection system for measuring paste area and volume easily.
    Malcom Co. Ltd
  • NM 3625B - Flight Inspection System The Normarc single-console MiniFIS is designed especially with multi-mission aircraft in mind. A MiniFIS weighs less than an average adult passenger and only occupies one seat position. Once installed, the MiniFIS can be removed from any aircraft in less than 30 minutes and re-deployed in about the same time, thanks to the modular building-block construction and unique peg-lock system.
    Normarc Flight Inspection
  • FOCIS-210 - FOCIS PRO Fiber Optic Connector Inspection System - Automatic analysis of fiber end-face cleanliness and integrity
    - Built-in IEC 61300-3-35, AT&T-TP-76461, and user defined limits
    - Superb handheld ergonomics
    - 1.3 μm/pixel analysis resolution
    - 0.5 μm visual detection capability
    - 1.0 μm optical system resolution
    - 400 μm x 350 μm field of view
    - Paired fiber images for before/after, input/output, etc
    - Integrated focus and snapshot controls
    - Capture, save, review and share images

    Fiber Inspection, connector inspection, end face, end-face inspection, fiberscope, fiber scope, microscope
    Excellent for use with WFW fiber wipes, Kimwipes, and other optical wipes to clean fiber endface, fiber end face. Perfect for use with Fujikura Fusion Splicer, AFL FAST Connectors, FuseConnect Fusion Spliced Field Terminated Connectors, NOYES fiber optic test equipment, fibre connector inspection, optical power meters, laser sources, and OTDR, connectors SC, FC, ST, LC, MU, MPO, MTP, Sticklers
  • ASR-260A - UV Concrete Field Inspection System The Spectroline ASR-260A UV Concrete Field Inspection System is the only on-site device that enables inspectors to instantly detect the presence of concrete-damaging alkali-silica reactivity (ASR) gel in previously hard-to-examine places. Use it on pavement, roads, highway-support structures, bridges, dams, railroad-support pillars, airport runways, tunnels, buildings and much more.
  • NIR-01 - Silicon Inspection System The NIR-01 imaging system is made of CNC engineered Aluminium alloy. The suruface protection is powder painting and electrolitic oxidation on pure aluminium surfaces. The frame of the system is a high quality industrial design. All components are designed for long term heavy usage with minimal maintenance needs. Electrical components are also selected for stability and durability. The block like electronics gives the advantage of easy and quick repair.
  • 03-0001-02-01 - Cell front side inspection system FS- print The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.
    ATMvision AG
  • 03-001-13-00 - Cell inspection system Solar cell 3D- Bow measurement The ATM 3D- Bow inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.
    ATMvision AG
  • NAT-31 - Microscope Inspection System This system is based on high clarity zoom optics and an USB 2.0 digital camera. It is designed to be a cost-effective, versatile solution for clinical, life science, materials science, semiconductor and educational professionals. The zoom optics have a 0.7X-4.5X objective lens, 2X relay lens and a 0.5X or 1.0X objective multiplier.
    J MicroTechnology
  • Vision Inspection Systems Development SofTest Designs Corporation has been developing Vision Inspection Systems for various industries for over 10 years. We have the capabilities to address your vision inspection needs. The professionals at SofTest Designs have a broad range of vision inspection experience. These experiences include but are not limited to the following industries: Automotive, Telecom, Consumer Electronics, Injection Molding.
    SofTest Designs
  • Bandoleer - Continuous Web X-ray Inspection System he Bandoleer x-ray inspection system is suitable for the inspection of blister packs, powder and sachet bandoleers before cutting and packaging. It is the first x-ray inspection system in the world which allows simultaneous filler feedback and inspection at the filler station.
  • phoenix microme|x DXR-HD - Microfocus X-ray Inspection System The phoenix microme|x DXR-HD is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI).
    GE Measurement &
  • TeraFab Series - Reticle Defect Inspection Systems for IC Fab Applications The TeraFab™HT reticle defect inspection system enables fabs to perform "early warning" reticle checks with 28nm logic / 3Xnm hp-node sensitivity, minimizing the risk of printing defective wafers before the excursion is caught. TeraFab reticle defect inspection systems are available as new systems or as field upgrades to existing TeraFab or h Series models.
  • GI4830 - LCD Glass Plate Inspection System An inspection equipment for 4th generation glass substrate.
    An original detection optics achieve high sensitivities. This equipment also features accurate front and back surface separate detection, a video monitor for particle review, and a high throughput for substrate.
    Hitachi High-Technologies
  • Candela CS20 - High Brightness LED Automated Wafer Inspection System The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.
  • 03-0001-02-04 - Cell front side inspection system FS print and color The ATM FS- print inspection system is a fast, non-contact technology and very small and easy to use system to detect defects in cells for solar production application.
    ATMvision AG
  • High-Accuracy Automated Optical Inspection Systems Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
  • STRATUS II - AOI (Automated Optical Inspection) systems The STRATUS II is the best system on the world market for the in-line inspection of multilayer hybrids, LTCC/HTCC and other screen or stencil printed, electroplated or sputtered structures. In-line inspection, where the wet print is inspected directly after the screen printer (and before the parts go into the drying oven), is the best way to ensure that no serial defects like a hole in the screen or screen aging, can happen.
    Stratus Vision GmbH
  • ERSASCOPE XL - PCB Inspection System The ERSASCOPE System XL allows for the use of either ERSASCOPE 1 or ERSASCOPE 2 optics for big board applications. With a wide range of movement, X-Y microadjustable antistatic table with integrated bottom side supports, measuring 600 x 700 mm (24" x 28") , and a 300 mm (12") telescopic arm, this system has been designed for the comfortable inspection of the largest PCBs.
    Kurtz Ersa
  • TFT-LCD Edge Inspection System This system is a inspection system to improve the productivity of line by detecting the critical errors of materials on the corner and adjunct surface in its early stage. It is possible to monitor the quality panel form by measuring and inspecting the items of dimension, burr, broken, and chipping as well as to prevent it from continuous and highly volume of defects.
    Synapse Imaging Co
  • NS1500 Series - Disk Surface Inspection System Ideal for defect analysis in the surface of substrate and disks. The sophisticated classify defect can be detected by the develop and evaluation disk surface inspection system that measure at a same spindle by optical interference, laser irradiation of multi bearing and newly developed incline defect method.
    Hitachi High-Technologies
  • IRIS™ - Die & Wafer Inspection Systems SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive architecture, the WIS can be configured for manual or automatic inspection on either a semiautomatic or fully automatic platform.

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