Highly Accelerated Life Test
Processes a product through extreme temperature, vibration and product tailored stresses to expose design limits.
See Also: HALT
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HALT – Highly Accelerated Life Test
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HALT is a process used on electronic assemblies and modules to determine weaknesses and the stress limits of a product by temperature cycling and omni-axial random vibration step stress. Inherent weaknesses in a products design and build are stimulated by applying increasing levels of mechanical stress. Within an accelerated timescale, faults in a product can be realised prior to product release and preventing failures occurring during after-sale user operation, very often during the warranty period.
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Temperature/Humidity Vibration Test Systems
EHVC SERIES
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The EHVC Series is designed for highly accelerated life testing, the demand of which from customers is increasing today. This is a joint system of the AGREE chamber and thermal shock chamber that we have manufactured and makes the temperature rate up to 20℃/min feasible with a compressor only. With this feature, the highly accelerated life test such as AGREE tests, most thermal shock tests can be performed with one unit.
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Highly Accelerated Life (HALT) Test
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HALT consists of high and low temperature and 3 axis vibration testing performed either individually or in combination.Highly accelerated life testing is performed to identify design weaknesses and problems prior to production. HALT subjects equipment to overstress conditions at a level which does affect life, but offers an advantage by reducing the design and development phases of a program.
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Non-Nitrogen HALT Chamber
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An advanced environmental test system that performs Highly Accelerated Life Testing (HALT) without relying on costly liquid nitrogen (LN2) for rapid cooling.
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Highly Accelerated Life Testing (HALT)
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Quickly validate reliability and identify manufacturing defects that could cause product failures in the field with MET’s Highly Accelerated Life Test (HALT)HALT technique uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field.
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PCIe X4 With 4x/8x Intel® Movidius™ Myriad™ X VPU Edge AI Acceleration Module
VEGA-340
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Four/Eight Intel® Movidius™ Myriad™ X VPU onboard. Hardware acceleration for common deep neural networks. Scalable for multiple video streams edge inference. 10 times the performance compared to the previous generation.
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Test Workflow Standard
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Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
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EFT Module for Teststand
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The Electronics Functional Test (EFT) Module for TestStand provides out-of-the-box tools to speed up development of automated tests for electronic assemblies including PCBAs, subassemblies and final assemblies. Test engineers can develop, deploy and execute test sequences quickly and efficiently with minimal custom code development for a shorter time-to-solution.
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Interactive Benchtop Test
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Strict time-to-market deadlines make it vital to efficiently debug and validate product designs. Virtual instrumentation provides a unified interface that gives engineers an advantage over traditional box instruments.
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Cable Free ATE
CABLEFREEATE
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Digalog Systems customizes resources to provide requirements or more cost-effective requirements that are not currently on the market.The CableFreeATE™ technology also affords lower cost and easier integration of some common offerings:- VPC 64 SPST Reed Relay- 0.1" Discrete Header 64 SPST Reed Relay- DL1-156R 72 SPST Reed Relay
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Design for Testability (DFT Test)
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Corelis can provide you with design consultation and an analysis of your design for boundary-scan testability. We will review your design and make specific recommendations that if implemented will improve the testability. We can also suggest improvements that will increase test coverage and allow boundary-scan to be implemented in a more cost-effective manner.This service also includes a DFT test coverage analysis that we recommend to do after schematic capture and before PCB layout. At this stage of product development, Corelis provides you with a comprehensive test coverage reports that identifies all of the boundary-scan nets and pins and classifies them as completely tested, partially tested, or not tested. The report also recommends where to add test points (pads) for physical “nails” access if additional test coverage is required.
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Open Test Platform for High Performance Automotive Applications
TSVP
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The R&S®TSVP family of products is an open test platform from Rohde & Schwarz ideal for high performance automated test equipment (ATE) applications. The chassis contains a mechanical frame, digital backplane, analog backplane, mains switching and filtering, power supply and diagnostic extensions. A highlight is the analog bus for routing measurement signals between different slots without additional external wiring.
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Universal OTP Functional Test System for the Production of Level and Fluid Sensors
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Multifunctional function tester with parallel test function based on the LXinstruments OTP2 system platform. The system is used for assembly, final test and calibration of liquid and level sensors for commercial vehicles, construction machinery and shipbuilding in a high mix / medium volume environment.
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Wireless Device Test
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New wireless standards, in addition to rising wireless usage, are increasing wireless device complexity while lowering price expectations. To counter rising costs, manufacturers require test systems optimized for efficiency.
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Semiconductor Test System
TS-960e
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The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Functional Test Fixtures
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Forwessun’s Functional Test Fixtures are tailored to validate the performance of your electronic assemblies, ensuring each product meets critical quality and functional standards. With customisable designs and precision engineering, these fixtures support a range of testing needs—from checking connectivity and function to confirming performance under real-world conditions. Built to handle rigorous demands, Forwessun's solutions are ideal for industries requiring reliable and repeatable results. Whether for high-volume production or specialised testing, our fixtures provide robust, adaptable support to maintain efficiency and accuracy throughout the testing process. We also create, and work with Ingun to create fixtures using the Ingun kit.
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Active Alignment Assembly & Test Platform
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Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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NI HIL and Real-Time Test Software Suite
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Suites combine LabVIEW Professional Development System with NI's most popular application softwareIncludes LabVIEW Professional, VeriStand, and the LabVIEW Real-Time and LabVIEW FPGA modulesEach new suite includes a one-year NI Training and Certification membershipSoftware is shipped on USB 3.0 media with NI device drivers included to speed up your installationConfigure real-time test applications quickly and easily; add custom functionality
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Scienlab Battery Test System — Cell Level
SL1002A
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Test System with up to 36 Channels.The Keysight SL1002A provides sink and source with 0 to 6 V, 100 to 600 A, 0.6 to 3.6 kW and 36 channels for battery cells.
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Non-Signaling RF Test Platform for Validation & Production
Universal Wireless Tester
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Wireless communication standards are increasingly integrated into vehicles as well as smart home and Internet-of-Things applications. They form the basis for connected services, advanced HMIs, and autonomous driving. The combination of constantly evolving standards and the integration of multiple wireless technologies with many RF channels into new product designs means that measurement speed and quality are becoming a priority.
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PXI Integration Platform
ATS-3100
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The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
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Fully-Automated CTIA-Compliant OTA Test System
TS8991
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The R&S®TS8991 OTA performance test system measures the spatial radiation and sensitivity characteristic as specified by CTIA and 3GPP.The system software provides ready-to-use test templates for OTA measurements and supports all wireless standards.The integrated report function collects all measured test data such as graphics or numeric results, test environments, EUT information and hardware setup in one document.
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VLSI Test Systems
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50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Photonics Module Test System
58625
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Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Electronics Functional Test
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Functional test for productive manufacturing. Manufacturers of products enabled by electronics must assure proper operation prior to shipment. Bloomy’s line of universal test systems are ideal for functional test of your PCBAs and subassemblies, from the simplest to the most complex. The UTS family of products combines high-performance test instruments, switching, power control and mass-interconnect hardware with our robust UTS software suite into a low-risk, cost-effective and powerful test solution for your device under test (DUT).
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Electronic Control Unit Functional Test
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End-of-line tests are critical to ensure passenger safety in the era of smarter vehicles. A flexible test solution is needed to ensure extensive test coverage and high test throughput with a low total cost of ownership.
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Digital Test Instruments
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Conduct pattern-based digital tests incorporating the latest parallel, digital, serial, and bus protocols with the PXIe-6943 digital test instrument.
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Antenna Test System
ATS1000
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Offering measurements on active and passive devices - supporting also extreme temperature testing. 5G is all about data, speed and reliability using high frequency millimeter wave bands. The lack of conventional external RF connectors makes 5G antenna characterization challenging. 5G antenna, chipset and UE manufacturers as well as wireless market operators need a viable solution for research, diagnostics and debugging up to type approval.
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Flex Socket Test Module
JT 2127/Flex Socket Test Module
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The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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In-Line Test System
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With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
