Showing results: 1 - 15 of 342 items found.
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Onto Innovation
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
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StarProd LTB -
MVG
The StarProd LTB is a unique defect detection bench for linear array antennas such as BTS. Tests performed on this bench instantly identify defects such as flawed or absent soldering, swapped wiring or short circuits. Results provide information on the position and type of any existing error. Operators can then immediately step in to make corrections knowing precisely how and where they are needed. StarProd LTB also performs tilt computations which can reveal a misconfiguration, or a mechanical or RF component defect. The end result: improved production processes and product quality.
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Teseda Corporation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Tessent DefectSim -
Mentor Graphics Corp.
Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
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EB40 -
Onto Innovation
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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KLA-Tencor Corp
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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KLA-Tencor Corp
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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eloZ1-1600 -
elowerk Testsystems
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1 can be integrated into table systems as well as into inline-systems.
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eloZ1-400 -
elowerk Testsystems
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
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F30 -
Onto Innovation
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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406A -
Testronics Inc.
The 406A is designed to target the highest number of assembly failures for the least amount of capital equipment cost, programming time, and maintenance costs. The precision Stimulus Measurement Unit provides AC/DC analog measurements that are accurate, stable, repeatable, and reliable.
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Vivax-Metrotech Corp
The non-intrusive measuring device takes measurements along the pipeline and plots the results directly onto the screen of the receiver. There is no need to carry extra logging and display devices. All the data is displayed and logged into the receiver for downloading to a spreadsheet or dedicated analysis program.
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NovusEdge -
Onto Innovation
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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4D InSpec® XL Surface Defect Gauge -
4D Technology
The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Stangers Testing Services
Building defect investigations and surveys are needed not only when problems arise but when assurance is required that defects do not exist or that the standard of construction is such that problems are unlikely
