Showing results: 1 - 15 of 27 items found.
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INCUS -
Aragón Photonics Labs S.L.
INCUS is a portable spectrophotometer that allows the measuring of the receiver tube optical properties in the solar field of a parabolic trough CSP plant.
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MT9510 XP / x16 -
Cohu, Inc.
The MT9510 XP / MT9510 x16 is a universal pick-and-place handler for packages such as QFP, BGA, Micro-BGA, CSP, TSSOP, PLCC, PGA, LGA, MLP/MLF.
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Silmat -
Phoenix Test Arrays llc
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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NEO-690Z / NEO-890Z -
Pony Industry Co.,Ltd
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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MS-1000 -
Micro Square Co., Ltd.
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Series S200, S300, S400, and S500 -
AlphaTest Corp.
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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MC889 -
Manncorp
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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CSP/Ballnest -
Aries
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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CSP/MicroBGA -
Aries
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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CSP-3 -
Chuan Sheng Electronics Co., Ltd.
● Universal power AC90~264V/DC127~380V● Build in power factor control circuit in high power model(120W~500W)● Available for series and parallel operation● To be a Back up power function with relay output in option( not available in model 20W and 24W)● RoHS & UL version in option● DIN rail mounting
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CSP-2 -
Chuan Sheng Electronics Co., Ltd.
● A wide range selectable to meet various application● 230K~300Khr. MTBF● RoHS version in option● Compact size with DIN rail mounting
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CSP-C2 -
TEGAM Inc.
TEGAM''s Humitran-C Series offers a total temperature and humidity monitoring solution for virtually any application. Each temperature/ humidity controller includes an RH & temperature duct probe, which can be placed up to thousands of feet from the controller. The C series controllers have dual set points with recorder and relay outputs for interfacing to air temperature & humidity devices.
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CSP-C1 -
TEGAM Inc.
TEGAM''s Humitran-C Series offers a total temperature and humidity monitoring solution for virtually any application. Each temperature/ humidity controller includes an RH & temperature duct probe, which can be placed up to thousands of feet from the controller. The C series controllers have dual set points with recorder and relay outputs for interfacing to air temperature & humidity devices.
