BGA

The BenchTop BGA inspector provides affordable basic X-Ray BGA inspection in a small bench top package. Real-Time Inspection packages start below $40,000.00 with digital image processing. ...more

The CS-100 X-Ray system provides ultra high-resolution images at magnifications up to 400 times and X-Ray tube resolutions down to 5 micron. The X-Ray source and X-Ray detector manipulation allows for a large variety of magnifications and field of views. ...more

Adapter. System (adapter and socket combination) converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. Allows BGA device to be plugged into and removed from application mother board. ...more

Ball Grid Array Circuit Bridge. A cost effective means of upgrading or testing without changing your PCB layout. The Circuit Bridge allows the user to connect existing BGA signal paths to achieve your desired results. ...more

63/69/88/149 BGA 0.8p  109/137/167 BGA 0.8p  188/202 BGA 0.65p  System/Handler T5375/M6541, T5581/M6741 ...more

The On-the-fly BGA Inspection System caters for high volume, high speed and non-stop production. This feature ensures that each BGA unit can be measured within a fraction of a second without affecting the performance of other production processes. To be precise ?70ms for a 14 X 22 mm BGA package with 153 balls using a Pentium P4. ...more

is the highest quality bench top 3 dimensional BGA inspection system available today. Featuring an advanced 3-Chip CCD Camera! Constructed with ESD safe components, it enables the operator to inspect BGA, PBGA, CBGA and MICRO-BGA for micro-cracking, surface structure, excess flux residue and much more. ...more

Orbotech's Ultra Discovery Series brings exceptional inspection performance for FC-BGA and advanced fine-line PBGA, CSP, FPC and COF production. Our field-proven SIP-powered systems come equipped with super-fast optical heads, specially designed for inspection of the finest lines down to 10µm. When combined with dedicated IC substrate panel underst ...more

Gryphics BGA contacting systems are standardized, SMT, low-cost, exceptional GHz- performance designs that provide an alternative to, high-priced, long-lead-time sockets. ...more

BGA/LGA Sockets for 1.00mm & 1.27mm Pitch Packages. For applications using BGA, LGA, CSP and other devices on 1.00mm, 1.27mm or larger pitch. The sockets are provided with 2 alignment pins for accurate placement on new application PCB?s -or- without alignment pins, for use with existing application PCB?s. ...more

Adapter Socket. System (adapter and socket combination) converts any BGA device into a PGA on 1.27mm [.050] or 1.50mm [.059] pitch. Allows BGA device to be plugged into and removed from application mother board. Socket accepts Aries BGA to PGA adapter, Data Sheet No. 23007. ...more

Unique in its class, Advantest's new M4841 Dynamic Test Handler enables high-throughput parallel test for very high volumes of devices and supports complex ICs and packages, including BGA, CSP and QFP. Because of its advanced performance capabilities and features, the M4841 is the optimal dynamic test handler for high volume production of devic ...more

One-touch attachment/removal fixture. Double-sided alignment. High-speed testing. Large-sized touch panel display. High-speed I/F. Enables to perform strip type CSP and BGA testing  ...more

AEM-Evertech Elite Test Sockets are high speed, reliable & low profile contactors use for testingf of BGA, QFP and other packages. It is ideal for ATE and manual test. These sockets are designed & built with ESD material and highly reliable test probes. ...more

The 1688-ES handles tray-based packages including BGA, CSP, µBGA and QFN/Leadless. Features throughout the handler make it ideal for handling high frequency devices without introducing additional noise into the test environment. ...more

Used for LD & PD submounts, OSA, IMOS, PLC, OEIC, Si benches, Hybrid Circuits, MCM, CSP, FC, BGA, and other microelectronic/optoelectronic devices. Minimizes handling devices remain in tray for all test , assembly and packaging operations: load once, unload once. Devices are gripped securely in tray for safe handling and repeatable process ...more

Strengthen test reliablity and avoid any test escape.  BGA TWO PASS test mode. Unloading 4 areas to differentiate scrap of unit. Intelligent intersectional stocking easy to statistics.  ...more

Cognex's BGA II Inspection Package is a set of vision tools for inspecting BGA, CSP, and flip chip devices for missing, misplaced, or improperly formed solder balls. ...more

Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations. ...more

The Orion can handle CSP, BGA, QFN, and other devices on laminated/molded panels or strips, as well as devices in lead frames, including TSOP, TSSOP, SOIC, MSOP, and SOT. The Orion functions as a standalone system or can be linked for in-line integration with other back-end processes. ...more

The Castle is a x1 to x9 site pick-and-place handler for tray-based packages including BGA, CSP, and μBGA. It is capable of thermally conditioning devices from -60C to +175C.  ...more

The Delta EDGE is a x1 to x16 site, ambient to +155° pick-and-place handler for tray-based packages. Its standard package size range is 3mm x 3mm up to 40mm x 40mm and includes BGA, QFP and QFN. The large soak area enables the EDGE to maintain peak processing speed (up to 6,000 UPH) at elevated temperatures. ...more

The FlashPAK Networked Programming System is designed to program the leading high-density Flash Memory devices at near theoretical minimum programming times, and at the lowest cost per programmed part. FlashPAK uses the fastest Flash programming architecture available to deliver unmatched yield and the highest possible throughput. Package supp ...more

Aetrium Series 1400/3000 IC Test Handlers are well suited for production volumes of surface mount devices. Device kits are available for PGA, LGA, PLCC, QFP, TQFP, BGA, uBGA, leadless packages, Chip Scale Packages and other packages up to 50 mm x 50 mm. The 1400/3000 handlers can operate over the full temperature range of ?55° C to +155° C and ...more

Aetrium Series 1400/3000 IC Test Handlers are well suited for production volumes of surface mount devices. Device kits are available for PGA, LGA, PLCC, QFP, TQFP, BGA, uBGA, leadless packages, Chip Scale Packages and other packages up to 50 mm x 50 mm. The 1400/3000 handlers can operate over the full temperature range of ?55° C to +155° C and ...more