XZIF
Zero Insertion Force interconnect (XZIF) is an innovative design solution to the challenges of high pin count semiconductor test interfacing that reduces total interface costs. A radical departure from traditional spring probe compliant connections and backplane connectors, the XZIF interconnect design utilizes cutting edge bump on flex technology to replace both spring probes and pin/socket connectors. Already selected by a leading ATE manufacturer for a next generation test system, XZIF offers significant cost savings over traditional interconnect systems and provides the higher densities and parallelism required by next generation ATE platforms.
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Xandex, Inc.
1125 N. McDowell Blvd.
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