XZIF

Zero Insertion Force interconnect (XZIF) is an innovative design solution to the challenges of high pin count semiconductor test interfacing that reduces total interface costs. A radical departure from traditional spring probe compliant connections and backplane connectors, the XZIF interconnect design utilizes cutting edge bump on flex technology to replace both spring probes and pin/socket connectors. Already selected by a leading ATE manufacturer for a next generation test system, XZIF offers significant cost savings over traditional interconnect systems and provides the higher densities and parallelism required by next generation ATE platforms.

Xandex, Inc.

1125 N. McDowell Blvd.
Petaluma, CA 94954
USA

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