XCV 2000 - BGA Inspection System
The On-the-fly BGA Inspection System caters for high volume, high speed and non-stop production. This feature ensures that each BGA unit can be measured within a fraction of a second without affecting the performance of other production processes. To be precise ?70ms for a 14 X 22 mm BGA package with 153 balls using a Pentium P4.
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Xceltron Technologies
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