Wafer Probe Capability
At the IBM Microelectronics Test Solutions Center, you will find wafer probe capability for 4" to 12" . Hot and cold chuck testing from -50°C to 150°C is also available. We use a wide variety of probing techniques from cantilever through Cobra (vertical array) Probing Technology and our capabilities include pre/post test inspection. All testing is done in a class 10K nominal environment with class 1 testing available. Inking with wash capability can also be done. Probe card design, build and repair can be coordinated through our test services center as well.
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IBM Microelectronics Test Solutions
2070 Route 52, M/S 5F1, Dept. 206A
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