Strip Test
Amkor is the first contract manufacturer to implement a high density, pre-singulated test process for many of the semiconductor industry's most common IC packages. By utilizing Amkor's high density leadframe (HDLF) assembly process, we are able to achieve high parallelism and throughput, thereby reducing the overall cost of test. Small outline and low lead count packages in high volume are the optimum product type for this process.
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Amkor Technology, Inc.
1900 South Price Road
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