Solder Ball Placement SBP 9300
SBP (Solder Ball Placement) is equipped with the flexibility to attach solder balls on PBGA, singulated BGA and array BGA packages. Capable of handling solder ball size of 0.2mm at 0.4m pitch. Substrate vision alignment system. Proprietary positive ball handling mechanism. Vision inspection to check for missing/ double/ offset/. oversize/ undersize solder balls. P-Coat application.
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Advanpack Solutions Pte Ltd.
54 Serangoon North Avenue 4
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