STATS' Plastic Ball Grid Arrays (PBGA) meet current established industry standards and offer thermal solutions from 0-4 watts using 2-layer and 4-layer substrates. STATS' PBGA is a laminate substrate based package with plastic overmolded encapsulation and an array of solder ball terminals. The PBGA package provides a low cost, advanced technology packaging solution, offering higher density over traditional gull wing packages. Its laminate substrate based construction, in conjunction with STATS' advanced design and simulation tools, allow optimizations to increase electrical and thermal performance. The PBGA is available in a broad range of JEDEC standard body sizes.
Features
Flexible body sizes range from 19mm x 19mm to 40mm x 40mm
1.00, 1.27 and 1.50mm ball pitch
Eutectic solder balls (62Sn / 36Pb / 2Ag)
Perimeter or full ball array
A range of ultra high density 3U matrix module brics available in 4 or 8 slot PXI sizes using high reliability Pickering Ruthenium Reed Relays. Bric family of switching capability is available in 4416 or 2880 crosspoints up to 10 Watts, 2212 crosspoints up to 20 Watts and 1600 crosspoints up to 60 Watts. This high level of switching density al ...more