MX2000IR Semiconductor Inspection
For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need nondestructive inspection for surface purity and evenness. Checking for defects beneath the surface is also especially important, as is measurement of features such as die bonds, active areas, dimensions and sealing glue on MEM components (e. g. sensors).
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Viscom
Carl-Buderus-Str. 9-15
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