Kinetek Inkless Inspection 2.0
Inspect the kerfs of post-saw wafers for chipping and cracking caused by the dicing process and store die bin data without die inking.
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Kinetek
711 Executive Boulevard Suite 'O'
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Kinetek Inkless Inspection 2.0
Inspect the kerfs of post-saw wafers for chipping and cracking caused by the dicing process and store die bin data without die inking.
|
Kinetek
711 Executive Boulevard Suite 'O'
|