AIT XUV Ultra-violet Illumination Laser-Scanning Patterned Wafer Inspection
The AIT XUV is KLA-Tencor's next-generation double-darkfield optical inspection tool incorporating UV illumination to achieve the critical sensitivity requirements needed for the 65-nm node. The AIT XUV provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system. This includes layers with grain, high color variation, or other noise sources such as CMP layer, copper/low-k interconnects, and multi-layer film stacks. With its improved APS, the AIT XUV also provides better focus, tracking performance, and die-to-die registration while delivering cost of ownership that's among the lowest in the industry.
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KLA-Tencor
160 Rio Robles
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