Advanpack Solutions Pte Ltd. Products
Advanpack Solutions Pte Ltd.
Advanpack Solutions Pte. Ltd. (APS) provides innovative and integrated flip chip solution to companies that manufacture semiconductors. Our proprietary flip-chip technologies include the Pillar Bump, No-Flow Underfill, fluxes, advanced packaging methods and various proprietary packages including Wafer Level Chip Scale packages.
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E Series Send To Colleague Automolding System. 100 tons toggle press (options for 60/80/140 tons). Multi-leadframe capability (2-8). Vacuum molding capability. 3P / 1P molding capability .Wedge mold for BGA. Cleaning roller for QFN molding. Pretape before molding / Detape after molding. Inline capability . Front access. Advanced molding technology. ...more -
Flip Chip Bonder AFC 8000 Send To Colleague Especially ideal for flipchip on leadframes - up to 8000uph. Placement accuracy 25 microns at 3 sigma Small die handling. Concurrent processes of die pickup, flux dip, die alignment, die placement. Die height compensation. "Look up, Look Down" vision alignment. Post placement vision check. Bump inspect before bond. P-Coat application ...more -
Singulation Sort System Family Send To Colleague High throughput with sorting capability, Tapeless and Tape Models. Clamp plates for sub 3 x 3mm cutting. QFN deburring capability . BGA & QFN vision check. Output options : tube, tape & reel, JEDEC tray, canister . Tape sorter model TS3. ...more -
Solder Ball Placement SBP 9300 Send To Colleague SBP (Solder Ball Placement) is equipped with the flexibility to attach solder balls on PBGA, singulated BGA and array BGA packages. Capable of handling solder ball size of 0.2mm at 0.4m pitch. Substrate vision alignment system. Proprietary positive ball handling mechanism. Vision inspection to check for missing/ double/ offset/. oversize/ unde ...more
