Showing results: 1 - 5 of 5 items found.
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Camtek Intelligent Imaging
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Camtek Intelligent Imaging
Growth in the advanced packaging market and the challenges raised by the various packaging types requires the highest level of inspection and metrology, ensuring high yields of each die as well as of the whole package.
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Camtek Intelligent Imaging
Designed mainly for Fanout Panel-Level-Package (FO-PLP) applications, Camtek’s Golden Eagle is used for the inspection and metrology of standard panel sizes, up to 650mm x 650mm. The Golden Eagle addresses the challenges of FOWLP while providing a robust system that addresses the most stringent, high-volume manufacturing requirements.
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Camtek Intelligent Imaging
Camtek offers dedicated inspection and metrology solutions for dicing-related processes, ensuring the reliability of the end product. Camtek developed new capabilities to address new dicing technologies such as Stealth and Plasma dicing using new algorithmic and technologies such as Back Light illumination, as well as various handling solutions.
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Camtek Intelligent Imaging
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.